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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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SnapEDA Introduces the KiCad Plugin
September 9, 2020 | SnapEDAEstimated reading time: Less than a minute
SnapEDA has a new offering, that will make it even easier for engineers to access CAD content. A new KiCad Plugin allows engineers to search, discover, and download content for electronic components directly from within the software where they’re designing PCBs.
KiCad is a free, open-source PCB design software that has been gaining popularity in the PCB design industry. Over the last few years, it has been growing at the same year-over-year rate as the industry’s leading PCB tools in terms of design activity in our professional PCB design community. Specifically for KiCad, the company has seen 345% growth of design activity over the last 3 years.
Being open source, KiCad’s ethos is to make electronics accessible and open, and we strongly resonate with that belief. For that reason, it’s also central to the open hardware movement.
Over the years, millions of CAD models have been loaded into the SnapEDA database, which are all accessible within the new plugin. Additionally, users will benefit from live updates to the SnapEDA library. The Component Engineering team adds thousands of new components each week, which are synced with the plugin in real-time.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.