Elementary, Mr. Watson: Inside the Display Power Loop
Powering the Future: Performance Is Won in Assembly
Connect the Dots: Total Value Manufacturing Solutions
Michael Ford, Aegis Software
#558: How The New IPC Digital Twin Standard Impacts Manufacturing Digital Twin, Digital Thread, IIoT, CFX, DPMX, Digital Shadow, Industry 4.0
The new IPC digital twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for "virtual prototyping" of all aspects of design, manufacturing, and beyond. The use of IPC-2551 prevents companies in all areas of the industry from making the mistake of tying themselves to any monopolistic data exchange technology.
The IPC digital twin as a standard is quite distinct from what has been seen until now in the form of proprietary solutions and technologies that offer a very small part of the overall digital value and are not easily interoperable. Since it’s built, in part, on existing IPC standards, such as IPC-2581 (DPMX), IPC-2591 (CFX), and IPC-1782 internal and external (secure supply chain) traceability, current solutions can quickly employ and connect standard digital twin modular components, creating true interoperability and real-time solution collaboration.
Figure 10: Standards create interoperability.
Ford’s presentation explains the IPC digital twin standard structure and components, using some specific use-case examples that illustrate the value and opportunity that the standard provides, exchanging digital models omni-directionally between design, manufacturing, and product lifecycle. This presentation will be of critical interest to all of those involved in design, manufacturing, and product management, including business leaders, engineers, and technology providers.
Figure 11: Digital confusion (aka “solutions”) creates a “digital tower of Babel.”
Vahid Akhavan, Ph.D., NovaCentrix
#567: Use of Flash Lamps to Achieve Non-Equilibrium Soldering and Assembly Utilizing Conventional SAC Alloys Flash Lamps, Photonic Soldering, Low-Temperature substrate, Non-Equilibrium Heating
The drive to enhance human interactivity and reduce the weight of electronic systems has led to the use of non-conventional substrates. As the substrates become thinner and more flexible and economical, the thermal stability of the working substrate is significantly lowered.
As such, the conventional modes of component attachment are no longer functional. To bridge this gap, anisotropic adhesives and tapes, as well as low-temperature solders and conductive epoxies, have been developed. However, in terms of performance, conventional soldering is still the champion. One way to combine traditional soldering techniques with thermally sensitive substrates is laser soldering. However, technical challenges, combined with the high costs of lasers, continue to create barriers to broader adoption.
Dr. Akhevan’s discussion focused on photonic soldering, which uses high-intensity flash lamps to overcome the disadvantages of laser soldering while still enabling soldering on a wide range of substrates. Similar to laser soldering, photonic soldering utilizes selective absorption of light to enable conventional solders (such as SAC305) to affix commercial packages (such as transistors, LEDs, or resistors in traditional sizes) on the underlying thermally unstable substrate (such as PET, PEN or TPU).
The very rapid (2–6 seconds) localized heating minimizes the component temperature rise, allowing the soldering of components that would be sensitive to a reflow oven. And it minimizes the local temperature of the substrate allowing newer, lower-cost films and thermoplastics to be employed as a substrate, like PVC, PP, LCP, polyester, PET, PEN, or TPU.
Figure 12: The PulseForge photonic soldering tool.
Figure 13: The value of photonic soldering is just now being explored.Page 3 of 7
