Fresh PCB Concepts: Key Considerations for Reliability, Performance, and Compliance in PCBs
Elementary Mr. Watson: Navigating RF—A Glide Path Approach to Design Success
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Real Time with… SMTAI 2020: Technical Conference Review
October 6, 2020 | Real Time with...SMTAIEstimated reading time: 16 minutes
Chris Hunrath, Insulectro
#905: Z-Axis Interconnects—Transient Liquid Phase Sintering (TLPS) Materials
Low-temperature liquid phase sintering (TLPS) metallurgy makes Z-axis interconnects during the lamination process rather than after. This allows for changes in the buildup sequence while having more freedom in via placement. This also opens up design possibilities and often simplifies fabrication.
Hunrath’s presentation provides a brief overview of the paste technology (what makes this possible), its manufacturing process, and some stackup examples that include high layer counts, high density interconnects, and the elimination of back drill with improved signal performance. TLPS has been used successfully by OEMs for the last 20 years to improve yields and allow for the mixing of materials in the same multilayer structure.
Figure 21: TLPS paste process overview.
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