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Atotech to Present at 17th International Wafer-Level Packaging Conference 2020
October 9, 2020 | AtotechEstimated reading time: 1 minute
Atotech, a leading global provider of electroplating and surface-finishing chemicals and equipment for PCB, semiconductor advanced packaging and dual damascene applications, will present at this year’s IWLPC. The on-demand conference and expo will be held from October 13th through 30th.
Atotech’s expert, Roger Massey, will give a technical paper presentation entitled “Hydrogen embrittlement and nano void classification within electroless copper depositions”. His presentation is part of the 3D Integration track and will be available for viewing during the entire time the conference is open. Attendees of this virtually held conference are invited to watch Mr. Massey’s presentation.
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: info@atotech.com.
About Atotech
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computing; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide.
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