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Electronics Additive Manufacturing for Defense and Space
October 27, 2020 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute

At the SMTA Additive Electronics TechXchange, Dr. Kourtney Wright spoke about Lockheed’s DoD work and explained why Lockheed is interested in additive. She has a background in chemistry and is now working in electronics chemistries.
Early in her presentation, Wright used the phrase “from the art to the part, quickly”—a euphemism that captured why Lockheed has an interest in additive. She outlined Lockheed’s objectives as follows:
- Small quantity manufacturing
- Unique designs
- 3D/conformal geometries
- Agile design and development, including rapid prototyping and single-part manufacturing
- Iterative design
- Finely tuned electronics
- Lower program cost, lower deployment cost, and quicker diagnosis of problems
Wright finished her presentation with an overview of the copper inks Lockheed is developing, evaluating, and using. She pointed out that to make the paste for printing, copper nanoparticles are passivated into the paste. Of particular interest was the fact that the copper paste, she noted, is solderable (unlike silver).
As she wrapped up her presentation, Wright shared one example application for additive and flex. Flex circuits can be used to replace a traditional wire harness, simplifying replacement to repair a failure—a plug-in replacement versus troubleshooting the location of a failed individual wire.
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.