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Electronics Additive Manufacturing for Defense and Space
October 27, 2020 | Nolan Johnson, I-Connect007Estimated reading time: Less than a minute

At the SMTA Additive Electronics TechXchange, Dr. Kourtney Wright spoke about Lockheed’s DoD work and explained why Lockheed is interested in additive. She has a background in chemistry and is now working in electronics chemistries.
Early in her presentation, Wright used the phrase “from the art to the part, quickly”—a euphemism that captured why Lockheed has an interest in additive. She outlined Lockheed’s objectives as follows:
- Small quantity manufacturing
- Unique designs
- 3D/conformal geometries
- Agile design and development, including rapid prototyping and single-part manufacturing
- Iterative design
- Finely tuned electronics
- Lower program cost, lower deployment cost, and quicker diagnosis of problems
Wright finished her presentation with an overview of the copper inks Lockheed is developing, evaluating, and using. She pointed out that to make the paste for printing, copper nanoparticles are passivated into the paste. Of particular interest was the fact that the copper paste, she noted, is solderable (unlike silver).
As she wrapped up her presentation, Wright shared one example application for additive and flex. Flex circuits can be used to replace a traditional wire harness, simplifying replacement to repair a failure—a plug-in replacement versus troubleshooting the location of a failed individual wire.
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06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
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06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.