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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Ultra Librarian, Zuken Create Seamless User Experience for PCB Design
October 27, 2020 | Ultra LibrarianEstimated reading time: Less than a minute
Ultra Librarian, the world's largest free cloud-based CAD library provider, announced its collaboration with Zuken to provide eCADSTAR users with a seamless process to search and download parts. “Ultra Librarian's goal is to provide resources to engineers that will allow them to increase productivity in the design phase,” said Manny Marcano, president and CEO of EMA. “This new integration is another step towards achieving that goal by providing eCADSTAR users seamless access to the time-saving resources available in Ultra Librarian directly within the tool.”
eCADSTAR provides a borderless electronic design environment that connects the engineering desktop with comprehensive online design, manufacturing services, and online educational content. Now, with a direct Ultra Librarian integration, users can browse parts, download, and design directly within eCADSTAR.
“We're excited to announce eCADSTAR's direct integration with Ultra Librarian,” said Jeroen Leinders, global eCADSTAR solutions leader. “Users will now have access to all the information they need to make intelligent design decisions and expedite the design process with Ultra Librarian's part information and CAD models.”
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.