-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
IPC Applauds U.S. House Approval of Defense Policy Act With Pro-Electronics Provisions
December 9, 2020 | IPCEstimated reading time: 1 minute

The following is a statement by John Mitchell, IPC President and CEO, on the vote by the U.S. House of Representatives to approve the final version of the Fiscal 2021 National Defense Authorization Act (NDAA):
“On behalf of the electronics manufacturing industry, we applaud the House for including provisions in the FY21 NDAA that will bolster the security and resiliency of the U.S. defense electronics supply chain.
“Section 841 will require the U.S. Defense Department (DoD) to implement new sourcing requirements and restrictions on bare printed circuit boards (PCBs) and PCB assemblies (PCBAs). Specifically, the bill would:
- Ban the sourcing of defense electronics from China, North Korea, Iran and Russia;
- Direct DoD to engage a federally funded R&D center to examine the expansion of sourcing restrictions to commercial PCBs and assemblies; and
- Extend "trusted supplier" requirements for microelectronics to PCBs and PCBAs.
“While we would have preferred the more comprehensive, affirmative approach to trusted suppliers embodied in the House- and Senate-passed versions of the NDAA, Section 841 is a strong step in the right direction, recommitting the U.S. Government to security and resiliency across the entire electronics value chain.
“Experts inside and outside of government have long recognized potential national security risks in PCBs and PCBAs that need to be remedied. This bill reflects the recommendations of many experts – including the DoD’s Executive Agent for PCBs – to redouble U.S. Government support for this long-neglected but critically important segment of the electronics manufacturing industry.
“Now we call on the Senate to approve the bill and on President Donald Trump to sign it into law without delay.”
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
A.R.T. Invests in Latest Equipment to Further Enhance Electronics Training Facilities
09/17/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, has announced a series of new equipment investments at its state-of-the-art training centre.
Richardson Electronics Appoints Daniel Albers to Drive Made-in-USA Contract Manufacturing Expansion
09/17/2025 | Globe NewswireRichardson Electronics, Ltd., a global provider of engineered solutions for the green energy, power management, and custom display markets, announced the appointment of Daniel Albers to spearhead business development for its expanded, Made-in-USA contract manufacturing efforts.
STMicroelectronics to Advance Next-generation Chip Manufacturing Technology with New PLP Pilot Line in Tours, France
09/17/2025 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026.
Indium President and CEO to Deliver ELCINA CEO Forum Keynote at Productronica India
09/17/2025 | Indium CorporationIndium Corporation President and CEO Ross Berntson will deliver the Electronic Industries Association of India (ELCINA) CEO Forum keynote at Productronica India, to be held September 17-19 in Bengaluru, India.
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.