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Cadence Webinar: Addressing Interconnect Modeling Challenges
December 17, 2020 | Cadence Design SystemsEstimated reading time: Less than a minute
Accurate SI/PI analysis requires ultra-accurate 3D model extraction. Cadence’s Clarity 3D Solver is enabling dozens of PCB and IC packaging teams to perform complex 3D model extractions and create ultra-accurate interconnect models for their most demanding SI/PI simulations, and up to 10X faster than the nearest legacy tool.
This webinar will take you through two test cases—a system-level memory interface and a rigid-flex PCB design—with the following key takeaways:
- Accurate power-aware SI simulations of system-level memory interface, enabled by 3D extractions of full memory bus
- Simulation of Rigid-Flex PCB in both flat and folded states
- Demonstration of what you miss when you do not simulate the folded state
To register for this free webinar, click here.
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