Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Cadence Webinar: Addressing Interconnect Modeling Challenges
December 17, 2020 | Cadence Design SystemsEstimated reading time: Less than a minute
Accurate SI/PI analysis requires ultra-accurate 3D model extraction. Cadence’s Clarity 3D Solver is enabling dozens of PCB and IC packaging teams to perform complex 3D model extractions and create ultra-accurate interconnect models for their most demanding SI/PI simulations, and up to 10X faster than the nearest legacy tool.
This webinar will take you through two test cases—a system-level memory interface and a rigid-flex PCB design—with the following key takeaways:
- Accurate power-aware SI simulations of system-level memory interface, enabled by 3D extractions of full memory bus
- Simulation of Rigid-Flex PCB in both flat and folded states
- Demonstration of what you miss when you do not simulate the folded state
To register for this free webinar, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.