Elementary, Mr. Watson: Controlled Impedance—When ‘Connecting the Dots’ Stops Working
Beyond Design: How Signals Survive the Hostile PCB Environment
Connect the Dots: What Designers Should Know About Non-conductive Via Fill
Accurate SI/PI analysis requires ultra-accurate 3D model extraction. Cadence’s Clarity 3D Solver is enabling dozens of PCB and IC packaging teams to perform complex 3D model extractions and create ultra-accurate interconnect models for their most demanding SI/PI simulations, and up to 10X faster than the nearest legacy tool.
This webinar will take you through two test cases—a system-level memory interface and a rigid-flex PCB design—with the following key takeaways:
- Accurate power-aware SI simulations of system-level memory interface, enabled by 3D extractions of full memory bus
- Simulation of Rigid-Flex PCB in both flat and folded states
- Demonstration of what you miss when you do not simulate the folded state
To register for this free webinar, click here.
