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Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Cadence Webinar: Addressing Interconnect Modeling Challenges
December 17, 2020 | Cadence Design SystemsEstimated reading time: Less than a minute

Accurate SI/PI analysis requires ultra-accurate 3D model extraction. Cadence’s Clarity 3D Solver is enabling dozens of PCB and IC packaging teams to perform complex 3D model extractions and create ultra-accurate interconnect models for their most demanding SI/PI simulations, and up to 10X faster than the nearest legacy tool.
This webinar will take you through two test cases—a system-level memory interface and a rigid-flex PCB design—with the following key takeaways:
- Accurate power-aware SI simulations of system-level memory interface, enabled by 3D extractions of full memory bus
- Simulation of Rigid-Flex PCB in both flat and folded states
- Demonstration of what you miss when you do not simulate the folded state
To register for this free webinar, click here.
Suggested Items
Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
07/10/2025 | MicrochipContinuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA.
OSI Systems Lands $17 Million Order for Cargo and Vehicle Inspection Systems
07/07/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received an order valued at approximately $17 million from an international customer for cargo and vehicle inspection systems.
KYOCERA AVX Releases New 3DB Hybrid Couplers
07/04/2025 | PRNewswireKYOCERA AVX, a leading global manufacturer of advanced electronic components engineered to accelerate technological innovation and build a better future, released a new line of integrated thin film (ITF) hybrid couplers designed to facilitate the continued evolution of high-frequency wireless systems in industrial, automotive, telecommunications, and telemetry applications.
Accenture Acquires SYSTEMA to Drive Manufacturing Automation for Semiconductor Clients
07/02/2025 | AccentureAccenture has acquired SYSTEMA, a provider of software solutions and consulting services for manufacturing automation, headquartered in Dresden, Germany.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.