Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
Elementary, Mr. Watson: Why Your PCB Looks Like a Studio Apartment
The Shaughnessy Report: A Plan for Floor Planning
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 25, 2020 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
We started this week with the solstice. Here in the Northern Hemisphere, it’s the winter solstice; south of the equator, of course, it’s the summer solstice. Not only is this a big event on the astronomical calendar, solstice is a busy time for holy days worldwide. Whichever holiday schedule you follow, we wish that yours is festive, restorative, and full of hopefulness.
All that holiday revelry can certainly distract one’s attention; as evidenced in a much slower news week. As a result, this week’s Top 5 brings you the three most important and/or intriguing pieces of news we’ve covered in the last week, and two items from last week that are still drawing reader attention this week. That’s I-Connect007: Keeping you informed, efficiently.
Enjoy your holiday and Happy New Year!
Prices of Copper-Clad Laminates Continue to Rise
December 18
Recently, two major explosions at epoxy resin plants in China had a great impact on domestic resin suppliers, interrupting the supply of resin and caused prices to increase dramatically. I-Connect007 reports on the market dynamics and effects.
The press release states, “Industry experts believe a five-year, $40 million investment in a public-private R&D program would yield more than $100 million in U.S. defense savings per year and improve military readiness and overall innovation. The Congress provided $5 million for such R&D in FY 2020.”
For more detail, find IPC President and CEO John Mitchell’s article in Defense News titled, “Protecting America’s military prowess requires an embrace of lead-free electronics.”
COMSovereign Delivers First Tethered Drone-Based LTE Network
December 21
Emergency and disaster response teams are a great example for this new LTE mobile network system. Imagine a wildfire command post setting up on a remote hilltop and launching a series of hovering drones to serve as temporary cell towers in an area otherwise outside cell service.
Dr. John Mitchell on IPC APEX EXPO Going Virtual
December 16
In this audio interview, Barry Matties and Dr. John Mitchell discuss IPC’s decision to move IPC APEX EXPO 2021 to an all virtual platform. Mitchell explains the reasoning for going virtual, and expresses his enthusiasm for the opportunities this presents the conference. I-Connect007 will be providing preshow and realtime coverage of IPC APEX EXPO, so check with us often to get the latest.
Happy Holden: ECWC15 Virtual Event a Success
December 15
Few industry experts are as capable as Happy Holden to review the Electronic Circuits World Convention, held recently in Hong Kong. In this report, Happy summarizes the keynotes from the first day of the three-day event. Keynote speakers include: NT Information Ltd’s Dr. Hayoo Nakahara; James Tam, from Bosch; and Happy Holden himself.
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Julia McCaffrey - NCAB GroupSuggested Items
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.