-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Chapter 1 Excerpt: The Printed Circuit Assembler’s Guide to Process Validation
December 31, 2020 | Graham Naisbitt, Gen3 SystemsEstimated reading time: 2 minutes
Quick and Convenient Contamination Testing
The original principle underlying the IPC’s ionic cleanliness requirement was that the mobility of surface ions, detectable from SIR measurements, would correlate to a maximum value of detectable ionic elements permissible on the circuit surface.
The industry required a test that was both fast and accurate for process control. Thus, a simplified ion chromatograph that was able to detect ionic elements without differentiation was created. Due to patent restrictions, there were—and still are—only two different instrument configurations: closed-loop and open-loop, which became referred to as static and dynamic instruments. Each instrument configuration must be capable of measuring the presence of a known amount of ionic contamination.
Based on an extrapolation of insulation resistance measurements, it was determined that there was an upper limit beyond which ionic elements would become mobile on the assembly surface, thereby potentially compromising electrochemical reliability. The number, although occasionally altered during the infancy of this test, was 1.56 µg/cm² NaCl equivalence. Despite the many technology changes employed in the period after the mid-1970s, many—if not most—felt it convenient to simply continue applying this rule as adequate evidence of the electrochemical reliability of their end-product.
The IPC has now withdrawn the requirement for 1.56 µg/cm² NaCl equivalence for a number of reasons as explained in IPC-WP-019A, which states, “For many years, military (e.g., MIL-STD-2000) and commercial (e.g., IPC-J-STD-001) manufacturing standards have required manufactured circuit card assemblies (CCAs) to meet an ionic cleanliness requirement of 1.56 microgram (µg) of sodium chloride (NaCl) equivalence per square centimetre (cm2) of extracted surface, using resistivity of solvent extract (ROSE) testing per IPC-TM-650, method 2.3.25.”
Therefore, it is the position of the IPC committees that the value of 1.56 µg NaCl equivalence per square centimetre should be considered as obsolete for the following seven reasons:
- This test methodology was originally developed in the 1970s. It was never intended to be used as a cleanliness test, nor as a test for product acceptability; it was only intended to be used as a process control method.
- The use of the ionic contamination value as a measure of product acceptance was the result of a U.S. Department of Defense desire to implement pass/fail criteria.
- This ionic contamination value, and those derived from them, were originally developed for high solids (35% solids) rosin fluxes and ozone-depleting chemical (ODC) cleaning. The flux chemistries and cleaning solutions used today are completely different from those used when the ROSE limits were established.
- Modern assemblies are simply too complex in terms of residues to have a single “one-size-fits-all” cleanliness criterion.
- There is mounting evidence that as CCA component density increases, so does the sensitivity of the circuit to ionic contamination. Modern circuit assemblies have far greater component densities than found in the 1970s. This also means that residues that had minimal impact on component technologies from the 1970s can now have a significant impact on component reliability.
- For many assemblies, ROSE testing is no longer a sufficient test regimen to adequately predict acceptable levels of ionic residues. IPC has compiled a list of technical presentations showing the inadequacy of ROSE to predict ionic residues for high-performance electronics.
- It is recognized that ionic residue testing is critical for reliable circuit function, so the ROSE test has continued in use until a more suitable alternative can be identified and implemented.
To download The Printed Circuit Assembler’s Guide to Process Validation, click here. You can also view other titles in our full library.
To view the Gen3 roundtable on the PICT standard, click here.
Suggested Items
IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
11/22/2024 | Dan Feinberg, I-Connect007In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.
Winners of IPC Hand Soldering World Championship at electronica 2024 Announced
11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
Enjoy the Journey: PCB Design Instructor Kris Moyer on His Sustainable Lifestyle
11/19/2024 | Michelle Te, IPC CommunityWhen I contacted IPC design instructor Kris Moyer to discuss his sustainable lifestyle, he responded to my text with a call. "I'm calling you from about 8,000 feet, sitting at the foot of Mammoth Lakes," he told me. “My friends and I are about to get in the pool for the afternoon." Kris can do this because he actually lives full-time in his travel-trailer at this campground. He's now a permanent camper, taking him anywhere the winds blow—and where there's strong internet service—so he can teach his PCB design classes, offer expert interviews, and live off the land.
IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence
11/19/2024 | IPCIPC, a leading global electronics industry association and source for industry standards, training and advocacy, is proud to announce its participation in National Apprenticeship Week, scheduled for November 17-23, 2024.