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Absolute EMS Announces Groundbreaking Technology for LED, Medical & Automotive from Averatek
March 8, 2021 | Absolute EMS, Inc.Estimated reading time: 1 minute

Absolute EMS, Inc., a leading provider of turnkey and consignment manufacturing services, is pleased to announce a new groundbreaking technology for LED, medical and automotive applications from high-tech partner Averatek Corporation. Santa Clara, California based Averatek recently launched Mina™, a chemistry that offers exciting benefits over traditional methods of soldering to Aluminum.
Absolute EMS assembles surface mount components onto polymer substrates with Aluminum traces using Averatek’s Mina™ product. Mina™ is a simple pretreatment for Aluminum that allows soldering to Aluminum as easily as soldering to Copper. It is printed onto the pads using a stencil printer and cured at low temperatures.
Doug Dow, Absolute EMS COO, commented: “It is truly an honor to be in partnership with Averatek. Their mission is to create solutions that deliver ‘tomorrow’s technology’ and this means that together, we are working on things the industry has never seen before. The transparent polymer substrate can be a very thin piece of flexible PET, with flexible Aluminum traces where the components are placed with strategic accuracy. Averatek’s team of PHD’s and Scientists are working with Absolute EMS to continually push the boundaries of science and technology. And this space is where Absolute EMS thrives!”
Averatek’s CEO, Haris Basit, wrote: “It has been wonderful working closely with Absolute EMS on bringing this new capability to the market. Absolute EMS combines the rigor and quality control of an established production facility with a flexibility and openness crucial to developing new products and processes. Finding one organization that encompasses both qualities has greatly accelerated our development cycle.”
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Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30