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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Ultra Librarian, TDK Partner to Provide Multi-Power Module Reference Design
March 25, 2021 | Ultra LibrarianEstimated reading time: 1 minute
Ultra Librarian, the world's largest free cloud-based CAD library provider, has announced its partnership with TDK to bring design engineers a 5W to 40W DC-DC multi-module reference design, from TDK's µPOL™ Embedded DC-DC Converters product line, that enables design engineers to go from concept to design in under 15 minutes.
“This reference design is available in eight CAD formats and its accuracy has been thoroughly tested and verified by the TDK engineering team,” said Manny Marcano, president and CEO of EMA. “Therefore, our customers can be confident in the quality of their starting point—in the CAD tool of their choice—rather than spending numerous hours recreating a design from a PDF and sourcing relevant parts.”
Reference designs are a key tool to help engineers understand, qualify, and successfully implement new components into their designs. To save time and reduce risk, engineers often end up using portions of the reference design circuitry in their design as these have already been tested and qualified by the component vendor. Unfortunately, most reference designs are only available in PDF or other static formats, requiring engineers to re-create the designs in their CAD tools, wasting time and creating opportunities for error during transcription. Reference designs from Ultra Librarian can be downloaded as native CAD files by design engineers, eliminating the risk and inefficiencies caused by downloading PDF's. This TDK reference design is available in OrCAD, Allegro PCB, Altium, Design Spark, Eagle, KiCAD, Mentor DX Designer, and Mentor PADS Logic formats, allowing designers to hit the ground running.
“The starter reference design features TDK's Chip Embedded µPOL DC-DC power modules, maximizing power delivery for high density, small form factor, and low-profile designs, which will ultimately enable higher PCB board density and better system level integration,” said Tony Ochoa, Director of Marketing, µPOL, TDK. “These power modules are ideal for crafting DC-DC power solutions in the nooks and crannies between and around the FPGAs, ASICs, memory, and under the hoods of heat sinks on the top or bottom of PCB boards or daughter cards, for design flexibility. These designs emphasize proper component placement, power and ground design, and thermal considerations for quick turnkey design in our customers' favorite CAD tool.”
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.