-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Global Unichip Corporation Deploys Cadence Clarity 3D Solver
April 28, 2021 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. has announced that Global Unichip Corporation (GUC) successfully deployed the Cadence® Clarity™ 3D Solver in its simulation workflow to design a complex network switch with hundreds of 112G PAM4 long-reach (LR) lanes. A 5X boost in simulation performance was key to GUC’s success. With proven scalable and high-performance system analysis and interconnect technologies, Cadence is a key enabler for hyperscale computing applications, including cloud data center and optical networking.
The efficiency of the Clarity 3D Solver required no partitioning of the design, thereby eliminating any concern of inaccurate results attributed to a fractured approach. On top of the “no partitioning needed” benefit, the GUC engineers achieved a five-fold speedup compared to legacy tools that relied upon partitioning. The Clarity 3D Solver’s combination of exceptional accuracy, speed and capacity enabled GUC to perform tradeoffs and what-if analysis before tapeout and to optimize the detailed ultra-scale, high-performance flip-chip BGA (HFCBGA) package design for peak performance at the lowest cost.
Furthermore, GUC streamlined its design process by utilizing the comprehensive Cadence IC Packaging design and analysis solution, including the Cadence Allegro® Package Designer Plus for implementation, Clarity 3D Solver for interconnect modeling, and Sigrity™ SystemSI™ technology to evaluate the 112G signal quality. The comprehensive solution embraced the integrated single-vendor workflow from Cadence that accelerates design turnaround time, enabling multiple optimization iterations while meeting all project milestones.
“As an ASIC design leader, delivering advanced designs to our customers in a timely manner is critical,” said Igor Elkanovich, CTO of GUC. “Enhanced performance for 3D finite-element method interconnect modeling was a key requirement for a successful collaboration. The Cadence Clarity 3D Solver delivered high-performance computational 3D full-wave modeling with gold-standard accuracy, enabling us to achieve optimized signal and power integrity along with a faster path to design closure. With a complete Cadence flow for design, analysis and signoff, we completed the design of a complex networking application for our customer.”
“Exciting new technology such as Clarity 3D Solver, Celsius™ Thermal Solver, and Sigrity X are foundational to Cadence cross-domain, multiphysics solutions addressing EM, thermal and SI/PI for today’s electronic systems. Customer response has been tremendous to the unprecedented performance, capacity, scalability and accuracy of the Clarity 3D Solver performing true 3D simulations of complete systems including interposer, package, and PCB,” said Ben Gu, vice president of multiphysics system analysis in the Custom IC & PCB Group at Cadence. “GUC is continuing its design engineering excellence through design of this next-generation data center switch, for which Cadence Allegro, Clarity and Sigrity technologies played a significant role in the design, analysis and signoff of hundreds of 112G LR lanes.”
The Clarity 3D Solver supports Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation. For more information on the Clarity 3D Solver, please visit www.cadence.com/go/clarityhyperscale.
About Cadence
Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For seven years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.
Suggested Items
Airbus Foundation Joins Forces with the Solar Impulse Foundation to Boost Climate Action
03/28/2025 | AirbusThe Airbus Foundation and Solar Impulse Foundation have launched a three-year partnership aimed at driving global progress on sustainability through fostering innovation and collaboration.
LN Phase Modulator, ASE Light Source Module for Fiber Optic Gyroscope
03/26/2025 | POINTekPOINTek, Inc., a global leader and provider of high performance athermal AWG products, announced launching of a new family of aerospace application products: Lithium Niobate Phase Modulator and ASE Light Source Module for Fiber Optic Gyroscope (FOG).
Altair, JetZero Join Forces to Propel Aerospace Innovation
03/26/2025 | AltairAltair, a global leader in computational intelligence, and JetZero, a company dedicated to developing the world’s first commercial blended wing airplane, have joined forces to drive next-generation aerospace innovation.
GKN Aerospace and Partners Successfully Complete ASCEND Programme, Transforming High-Rate Composite Manufacturing
03/21/2025 | GKN AerospaceGKN Aerospace, in collaboration with McLaren Automotive and other UK partners, proudly announces the successful completion of the ASCEND (Aerospace and Automotive Supply Chain Enabled Development) programme.
GKN Aerospace Recognised for Excellence in Safety at GE Symposium
03/17/2025 | GKN AerospaceGKN Aerospace is proud to have been honoured with the Excellence in Safety award at the GE Symposium. Representing our team, Priscilla Camanho and Lars Mattgard accepted the award, recognizing our commitment to maintaining the highest safety standards in the industry.