-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Global Unichip Corporation Deploys Cadence Clarity 3D Solver
April 28, 2021 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. has announced that Global Unichip Corporation (GUC) successfully deployed the Cadence® Clarity™ 3D Solver in its simulation workflow to design a complex network switch with hundreds of 112G PAM4 long-reach (LR) lanes. A 5X boost in simulation performance was key to GUC’s success. With proven scalable and high-performance system analysis and interconnect technologies, Cadence is a key enabler for hyperscale computing applications, including cloud data center and optical networking.
The efficiency of the Clarity 3D Solver required no partitioning of the design, thereby eliminating any concern of inaccurate results attributed to a fractured approach. On top of the “no partitioning needed” benefit, the GUC engineers achieved a five-fold speedup compared to legacy tools that relied upon partitioning. The Clarity 3D Solver’s combination of exceptional accuracy, speed and capacity enabled GUC to perform tradeoffs and what-if analysis before tapeout and to optimize the detailed ultra-scale, high-performance flip-chip BGA (HFCBGA) package design for peak performance at the lowest cost.
Furthermore, GUC streamlined its design process by utilizing the comprehensive Cadence IC Packaging design and analysis solution, including the Cadence Allegro® Package Designer Plus for implementation, Clarity 3D Solver for interconnect modeling, and Sigrity™ SystemSI™ technology to evaluate the 112G signal quality. The comprehensive solution embraced the integrated single-vendor workflow from Cadence that accelerates design turnaround time, enabling multiple optimization iterations while meeting all project milestones.
“As an ASIC design leader, delivering advanced designs to our customers in a timely manner is critical,” said Igor Elkanovich, CTO of GUC. “Enhanced performance for 3D finite-element method interconnect modeling was a key requirement for a successful collaboration. The Cadence Clarity 3D Solver delivered high-performance computational 3D full-wave modeling with gold-standard accuracy, enabling us to achieve optimized signal and power integrity along with a faster path to design closure. With a complete Cadence flow for design, analysis and signoff, we completed the design of a complex networking application for our customer.”
“Exciting new technology such as Clarity 3D Solver, Celsius™ Thermal Solver, and Sigrity X are foundational to Cadence cross-domain, multiphysics solutions addressing EM, thermal and SI/PI for today’s electronic systems. Customer response has been tremendous to the unprecedented performance, capacity, scalability and accuracy of the Clarity 3D Solver performing true 3D simulations of complete systems including interposer, package, and PCB,” said Ben Gu, vice president of multiphysics system analysis in the Custom IC & PCB Group at Cadence. “GUC is continuing its design engineering excellence through design of this next-generation data center switch, for which Cadence Allegro, Clarity and Sigrity technologies played a significant role in the design, analysis and signoff of hundreds of 112G LR lanes.”
The Clarity 3D Solver supports Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation. For more information on the Clarity 3D Solver, please visit www.cadence.com/go/clarityhyperscale.
About Cadence
Cadence is a pivotal leader in electronic design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to systems for the most dynamic market applications, including consumer, hyperscale computing, 5G communications, automotive, mobile, aerospace, industrial and healthcare. For seven years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.
Suggested Items
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
Kitron: Q1 2025 - Strong Start to the Year
04/25/2025 | KitronKitron reported first-quarter results characterised by continued momentum in the Defence & Aerospace market sector and a growing order backlog.
RTX's Collins Aerospace Enhances Capabilities to Speed Marine Corps Decision-making in Battle
04/22/2025 | RTXCollins Aerospace, an RTX business, successfully demonstrated new technology that helps the military gather and use information from a wider range of sources at Project Convergence Capstone 5, a large-scale military exercise.
AdvancedPCB Appoints Gary Stoffer as Chief Commercial Officer
04/18/2025 | PRNewswireAdvancedPCB is proud to announce the appointment of Gary Stoffer as its new Chief Commercial Officer (CCO). In this role, Stoffer will lead all sales, marketing, and commercial strategy initiatives as the company continues its mission to deliver cutting-edge PCB solutions to industries worldwide.
Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments
04/15/2025 | Real Time with...IPC APEX EXPOThings are looking bright for GreenSource. Michael Gleason shares an update on GreenSource's recent growth and upcoming changes. A recipient of a Defense Production Act Investment Program award, GreenSource is planning for new substrate capabilities. Current investments continue to enhance equipment and sustainability initiatives such as water quality. And their unique collaboration with the University of New Hampshire continues to aid their workforce development, despite recruitment challenges.