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Keysight Unveils Comprehensive Design, Test Workflow for Next-Generation Memory Designs
April 29, 2021 | Keysight Technologies, Inc.Estimated reading time: 2 minutes
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, announced a comprehensive workflow solution - PathWave Advanced Design System (ADS) 2022 - that reduces design time and de-risks product development for Double Data Rate 5 (DDR5), Low-Power Double Data Rate 5 (LPDDR5) and Graphics Double Data Rate 6 (GDDR6) memory systems.
From cloud computing to autonomous vehicles, the demand for faster memory interfaces is accelerating. A disruptive technology feature of fast interfaces such as DDR5, LPDDR5 and GDDR6 is equalization on the memory chip's receivers, which recovers signals degraded by their path through the printed circuit board (PCB). Hardware engineers need to minimize the risk of signal integrity issues in memory bus designs, which requires the ability to predict the signal quality after equalization, prototype the design and test for performance.
Keysight's PathWave ADS 2022, a design and test workflow for next-generation memory, enables hardware engineers to meet time-to-market requirements and deliver a high-performance, reliable end-product. The Memory Designer in PathWave ADS 2022 addresses the following design challenges:
- Model the transmitter and receiver behavior accurately by generating advanced simulation models of both DDR transmitters and receivers, with flexible equalization and external clock inputs.
- Optimize equalization settings to predict design margins with an advanced simulator that uses adaptive equalization to find the optimal settings for the best signal integrity of the data link.
- Quantify margin to the eye-mask by predicting eye closure down to standard-specific Bit-Error-Rates, and report remaining margin to the eye-mask.
- Find failing conditions with design exploration by generating a batch simulation list to sweep through all possible design parameters and report passing/failing configurations as spreadsheet data.
- Confidence in design sign-off, from design through to test by performing an automated compliance report on simulated signal waveforms and utilizing consistent measurement science to identify issues early and trial potential fixes efficiently
"PathWave ADS' leading-edge signal integrity simulator helps Xilinx in our advanced system memory development. Working with Keysight, we're able to optimize system memory solutions for our customers," said Thomas To, director of System Memory SI at Xilinx.
"DDR5 is a revolutionary technology, requiring designers to re-assess their simulation and measurement approaches," stated Brig Asay, director of Strategic Planning – Internet Infrastructure Group at Keysight. "Keysight's knowledge in both DDR5 simulation and measurement techniques, enables us to help customers through this technology hurdle, and speed them to a first-pass design success."
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Everspin Executes $40M Agreement for Mil-Aero MRAM Applications
04/30/2026 | Everspin Technologies, Inc.Everspin Technologies, Inc., the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, announced an agreement with a U.S. prime contractor to provide state-of-the-art Toggle MRAM process technology capabilities and engineering services for United States Defense Industrial Base customers.
Swinburne University, Siemens Launch Australia’s First Quantum Timing Study for Smarter Power Grids
04/30/2026 | SiemensSwinburne University of Technology and Siemens are undertaking first-of-its-kind research in Australia, into how quantum-enhanced timing can help future-proof the energy grid and increase grid stability.
A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.