-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Cadence Wins Four 2020 Samsung Foundry SAFE EDA Awards
May 5, 2021 | Business WireEstimated reading time: 2 minutes

Cadence Design Systems, Inc. announced that it has received four 2020 SAFE EDA awards from Samsung Foundry. Cadence garnered a best technical support award for a 3nm test vehicle tapeout for Samsung Foundry’s next-generation gate-all-around (GAA) technology as well as a best innovation award for Samsung Foundry’s 5nm/7nm full-chip design certification of the Cadence® Pegasus™ Verification System. In addition, Cadence won two awards for best collaboration—one for its role in the Samsung Foundry advanced-node analog/mixed-signal (AMS) ecosystem, which is dedicated to 3nm advancement, and the other for delivering a newly enhanced automotive reference flow for functional safety and reliability.
These awards were given to Cadence based on the following work that has been delivered:
- 3nm test vehicle tapeout for next-generation GAA technology: The Cadence full digital tool suite was used to implement and sign off timing on a 3nm test chip tapeout, demonstrating real silicon data as a proof of concept for advanced-node customers.
- Pegasus Verification System 5nm/7nm certification: The Cadence Pegasus Verification System, certified for Samsung Foundry’s 5nm and 7nm process technologies, has been optimized to enable advanced-node customers to reach signoff accuracy and runtime goals in a variety of market areas, including the mobile and hyperscale markets.
- 3nm AMS enablement: The Cadence custom and AMS IC design flow achieved certification for Samsung Foundry’s 3nm GAA technology, providing mutual customers with access to a highly automated circuit design, layout, integrated signoff and verification flow with unique in-design electrically driven, EM-aware place-and-route custom automation capabilities to efficiently design products for automotive, mobile, data center, artificial intelligence (AI) and other emerging applications. Tools in the flow included the Virtuoso® custom IC design platform, the Spectre® Simulation Platform and the Innovus™ Implementation System.
- Automotive reference flow enablement: Cadence optimized its digital full flow for Samsung Foundry’s 14LPU process technology using the Cadence Tensilica® ConnX B10 DSP, enabling automotive designers to quickly deliver accurate first-time silicon, achieve power, performance and area (PPA) goals, and meet functional safety and quality/reliability targets.
“We’ve worked with Cadence to ensure our mutual customers have access to our latest technologies so they can achieve the best possible design results and get to market faster,” said Jaehong Park, executive vice president of Foundry Design Platform Development at Samsung Electronics. “Cadence delivered exemplary innovations last year, and the Samsung Foundry SAFE EDA awards were certainly well deserved.”
“Enabling our customers to achieve design excellence is our top priority, and these awards from Samsung Foundry are indicative of our commitment to working closely with customers to reach their goals,” said Michael Jackson, corporate vice president, R&D in the Digital & Signoff Group at Cadence. “Through our continued collaboration with Samsung Foundry, we’ve successfully delivered new technologies so that customers can create products across a variety of emerging areas, including the automotive, mobile and hyperscale markets.”
Cadence tools and flows are part of the company’s Intelligent System Design™ strategy, which enables SoC design excellence.
Suggested Items
Metanoia Licenses Cadence Tensilica ConnX 230 DSP for New SDR Platform
03/26/2025 | Cadence Design SystemsThe transition from analog to software-defined radio (SDR) represents a significant advancement in communication technology. Traditional analog systems rely heavily on fixed hardware for signal processing, which limits their flexibility and adaptability.
Cadence Joins Intel Foundry Accelerator Design Services Alliance
03/17/2025 | Cadence Design SystemsCadence is expanding its collaboration with Intel Foundry by officially joining the Intel Foundry Accelerator Design Services Alliance! This collaboration amplifies both companies' efforts to drive innovation, support advanced chip design, and solidify Intel Foundry as a leader in cutting-edge semiconductor solutions.
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
Cadence Reports Q4, Fiscal Year 2024 Financial Results
02/20/2025 | Cadence Design SystemsYear-end backlog was $6.8 billion and current remaining performance obligations (cRPO), contract revenue expected to be recognized as revenue in the next 12 months, was $3.4 billion
MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
01/27/2025 | Cadence Design SystemsCadence announced that MediaTek has adopted the AI-driven Cadence® Virtuoso® Studio and Spectre® X Simulator on the NVIDIA accelerated computing platform for its 2nm development.