-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Siemens Receives Three Samsung Foundry SAFE EDA Awards
May 25, 2021 | SiemensEstimated reading time: 2 minutes
Siemens Digital Industries Software announced that long-term partner Samsung Foundry has recognized its partnership and substantial contributions to the broader Samsung Foundry ecosystem over the past year with three Samsung SAFE Awards. As part of its inaugural Samsung SAFE (Samsung Advanced Foundry Ecosystem) awards program, Siemens is recognized in the categories of Best Innovation, Best Collaboration and Best Technical Support. The new Samsung Foundry awards program recognizes achievement of the highest standards of design, development, and technology implementation to accelerate silicon innovation.
“I’m pleased to congratulate Siemens as the winner of these three 2020 Samsung Foundry SAFE awards for their EDA solutions,” said Jaehong Park, executive vice president of Foundry Design Platform Development at Samsung Electronics. “These awards reflect our continued partnership with Siemens to address customers’ 2D and 3D design challenges across elements of Samsung Foundry’s design flows and target markets for our most advanced process nodes.”
Siemens’ High Density Advanced Packaging (HDAP) flow earned the Best Innovation award for collaboration on Samsung's Multi-Die Integration (MDI™) packaging solution, which helps mutual customers rapidly prototype, implement, verify and thermally analyze their highly sophisticated multi-die package implementations. The Siemens technologies powering the HDAP flow include:
- Xpedition™ Substrate Integrator software, which enables rapid early prototyping and planning of heterogeneous semiconductor package assemblies,
- Xpedition™ Package Designer software, which provides constraint-driven place-and-route functionality with manufacturing preparation,
- Simcenter™ Flotherm™ software, which delivers complete package assembly thermal modeling and analysis,
- Simcenter™ 3D software, which provides complete, thermally induced stress and reliability analysis for package assemblies,
- Calibre® 3DSTACK software, which provides signoff DRC and LVS checking of complete multi-die system assemblies at any process node.
Siemens’ Calibre® YieldEnhancer (SmartFill) product team earned Samsung’s Best Technical Support recognition. The Calibre YieldEnhancer tool combines advanced design analysis with multiple filling solutions to optimize chip filing for both digital and analog designs.
The product team for Siemens’ Calibre Circuit Verification suite won this year’s Samsung SAFE award for Best Collaboration. The team worked closely with Samsung to ensure that each of the following tools in this suite support Samsung’s latest process technology:
- Calibre® nmLVS software -- Samsung Foundry was the first foundry to leverage the Calibre nmLVS-recon offering to speed circuit verification during early design,
- Calibre® PERC reliability software, which employs a unique, integrated analysis to automate complex reliability verification checks,
- Calibre® xACT parasitic extraction software, which delivers the high levels of accuracy required for three dimensional FinFET structures.
“Siemens is pleased and honored that our long-lasting partnership with Samsung Foundry has resulted in these first SAFE EDA awards,” said Michael Buehler-Garcia, vice president of Product Management for Calibre Design Solutions at Siemens. “As our mutual customers continue to develop higher complexity designs, Samsung Foundry and Siemens will continue to partner to enable the advanced platforms customers need to bring these increasingly sophisticated designs to life.”
Suggested Items
Podcast Review: On the Line With… Designing for Reality
05/09/2024 | Duane Benson, Positive Edge LLCAs a technologist, if I were forced to come up with just one recurring theme that I might call a professional “nemesis,” it would be the difference between theory and reality. A lot of technology we have at our disposal works well in theory but falls short when reality hits. That’s not the only reason I chose to listen to and review On the Line With… Designing for Reality, featuring a series of conversations with ASC Sunstone’s Matt Stevenson, but it certainly helped that the title caught my eye.
EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS
05/09/2024 | EMA Design AutomationLearn how the MCAD and ECAD experts at Hawk Ridge and EMA can help you solve your MCAD/ECAD integration challenges with this unique collaboration environment.
Sondrel Awarded New Video Processor ASIC Design and Supply Contract
05/09/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract for a next generation, video processing chip.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.