The Pulse: Caught in the Crosshatch—A Cautionary Tale of Detective Work
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
Ultra Librarian Partners with Vishay to Provide Free 3D Vishay CAD Models
July 13, 2021 | Ultra LibrarianEstimated reading time: 1 minute
Ultra Librarian, the world's largest free cloud-based CAD library provider, announced its partnership with Vishay Intertechnology, Inc. to provide free symbols, footprints, and 3D models for download from ultralibrarian.com in over 30 CAD formats.
“Ultra Librarian users can now download new, up-to-date Vishay components,” said Manny Marcano, president and CEO of EMA. “And because of our partnership, the Vishay catalog now available for download on Ultra Librarian will continue to grow. Ultra Librarian users can even request Vishay models that aren't currently available, and they will be created within two business days.”
The Ultra Librarian models are built to globally recognized industry standards and go through a rigorous verification process prior to being uploaded into the library. Design engineers can depend on the quality of the Ultra Librarian models, as well as save a tremendous amount of time, because the manual creation of the symbols, footprints, and 3D models has been eliminated. This is especially important for smaller engineering and prototyping teams in larger organizations that need to be able to realize designs and concepts quickly. The Vishay library of components in Ultra Librarian will continue to expand throughout 2021.
“This partnership with Ultra Librarian will enable our customers to take full advantage of this valuable resource to accelerate design creation,” said Joel Smejkal, executive vice president of business development at Vishay. “Providing easy access and the breadth of formats will help designers speed their path to production with Vishay components.”
For more information about Ultra Librarian or to download CAD models from its library of over 15 million parts for free, visit www.ultralibrarian.com.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
CIL Joins EU Project OSYRYS to Bring Hybrid-electric for Regional Flight Closer to Reality
03/24/2026 | CILWhat if the future of regional flight was hybrid-electric—and closer than you think? CIL joins a diverse group of 24 EU industrial, research, and academic partners to make it reality.
DigiKey Collaborates with STMicroelectronics and Ultra Librarian to Deliver Enhanced eDesignSuite Integration
03/20/2026 | PRNewswireDigiKey, the global distribution leader of electronic components and automation products, announces the availability of an enhanced eDesignSuite experience, developed through a collaboration with STMicroelectronics (ST) and Ultra Librarian.
STMicroelectronics Advances Ultra-Wideband for Automotive and Smart Devices
03/13/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, introduces an ultra-wideband (UWB) chip family that comprehensively supports the next-generation wireless standard for localizing and tracking devices at distances up to several hundred meters.
IC Substrates vs. UHDI: The Future of Interconnect
03/15/2026 | Marcy LaRont, I-Connect007Advanced packaging is driving feature sizes below 50 microns, forcing IC substrates and UHDI PCBs into overlapping territory. Following his presentation at the Pan-European Design Conference (PEDC) in January, Jan Pedersen, director of technology at NCAB Group, spoke with us about how heterogeneous integration, evolving HDI roadmaps, and supply chain pressures are shaping the next phase of advanced packaging.