-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Ansys Provides Competitive Edge to Future Workforce
July 16, 2021 | ANSYSEstimated reading time: 1 minute

Through the launch of its Electronics Desktop product for students, Ansys lowers the barrier to adoption for electronics simulation software and fuels the incoming workforce with a skillset necessary for next-gen innovation. The new student software provides free access to Ansys’ industry-leading Electronics product line—rounding out its existing and comprehensive student offerings for Ansys’ Mechanical, Fluids, Discovery and SCADE products.
As companies around the world grow more dependent on simulation to overcome complex design challenges, there is an intense demand for simulation-trained engineers. The new addition to Ansys’ Academic Program will empower students to further develop this critical skillset for electronics design and provide them a competitive edge in the job market.
“Through its robust Academic Program, Ansys helps engineering students become successful both inside and outside of the classroom,” said Kathryn Leigh Smith, assistant professor in the Department of Electrical and Computer Engineering at the University of North Carolina-Charlotte. “The addition of Electronics Desktop for students makes self-learning easier and more accessible. In addition, the Electronics-based Innovation Courses we jointly developed with Ansys empower students to level-up their education across physics disciplines.”
Students with access to the Ansys Electronics Desktop Student product can support self-paced learning inside and outside of the classroom through thirteen related Ansys Innovation Courses. The free software download and courses put learning in the hands of the student while also enabling educators to present and reinforce various physics concepts.
“Supporting engineers during every phase of their career is a top priority for Ansys. This launch will enable students to excel in an increasingly competitive, dynamic and evolving global economy, and – ultimately – help shape the future of product design as these students become the next generation of inventors,” said Prith Banerjee, chief technology officer at Ansys. “Since we launched Ansys Student, the most popular content request we received from students is free electronics training. Today, we’re delivering on those requests—eliminating barriers and improving access for students at the undergraduate and graduate levels.”
The Ansys Academic Program provides simulation software and materials education resources to support research and engineering, science and design curricula for more than 2,750 universities around the world. Beyond free student products, which have surpassed 1.8 million downloads, Ansys provides tools and resources for learning and developing simulation skills, including the Ansys Learning Forum, Ansys Innovation Courses, and university-based student team sponsorships.
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.