Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
Semtech Purchases Hentec/RPS Pulsar Solderability Test System
August 11, 2021 | Hentec Industries/RPS AutomationEstimated reading time: Less than a minute
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Semtech Corporation has purchased a Pulsar solderability test system. The Pulsar solderability test system is used to determine how well molten solder will wet on solderable surfaces of electronic components and is ideal for high-reliability applications. The Pulsar utilizes the dip-and-look test method that is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder.
An advantage of the dip-and-look method is since it is based on the comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment than a wetting balance test system. The Pulsar solderability test system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002, and MIL-STD-202 Method 208. The Hentec/RPS Pulsar dip-and-look test system can also be configured for low-volume lead tinning of component terminations that exhibit poor solderability due to oxidation or prolonged storage.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
TE Connectivity Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/09/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that TE Connectivity has finalized the purchase of a Pulsar solderability testing system.
GEN3 to Demo SIR Testing, Stencil Cleaning & More with Horizon Sales at IPC APEX 2024
03/07/2024 | Gen3Gen3, global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, to announce its participation in the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. At booth 3934, GEN3 will be exhibiting alongside Horizon Sales, presenting a lineup of advanced technologies aimed at enhancing the efficiency and reliability of circuit assembly processes.