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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Ansys, Electro Magnetic Applications Launch EMA3D Charge
October 21, 2021 | ANSYSEstimated reading time: 2 minutes
Together with Electro Magnetic Applications, Ansys added EMA3D Charge to its industry-leading simulation solution portfolio, addressing critical design and safety needs for applications ranging from space exploration to everyday commutes. The new solution enhances predictive accuracy for engineers analyzing charging and discharging events that can lead to catastrophic product failures early in the design cycle, driving faster time-to-market and bottom-line savings.
Aerospace, electronics and automotive industries must meet rigorous electrical performance requirements to mitigate safety risks related to charging and discharging events. Engineers need to be confident a spacecraft will survive exposure to space plasma. High-voltage systems must operate safely without risk of fire. Autonomous vehicles must maintain safety critical functions when faced with an unexpected electrical event. Without fully understanding and addressing these risks, companies may face costly late-phase redesigns, often totaling millions of dollars.
High-fidelity predictions from EMA3D Charge provide engineers with a deeper understanding of electrical charging and discharging phenomena. These insights can have a significant impact on product design, helping engineers determine how electrical components may be harmed — and to what extent — by charging and discharging events. Mitigating risks early in the design phase reduces the chances of late-stage redesigns and costly product failures.
“EMA3D Charge has an impressive array of capabilities,” said EMC engineers at NASA Johnson Space Center. “For example, its ability to easily manipulate and mesh mechanical computer-aided design (CAD) models greatly simplifies the process of going from a structural model of the spacecraft to analytical results. We have also seen great value in its ability to perform charging analysis on spacecraft that are being charged by direct contact with lunar dusts whilst simultaneously being charged from exposure to space plasmas on or near the lunar surface.”
While the technology within EMA3D Charge has been applied in the electronics and aerospace industry before, the solution is the first to be focused entirely on charging and discharging prediction. Leveraging Ansys SpaceClaim to create an intuitive user interface and workflow, EMA3D Charge combines CAD import, design and simplification, simulation setup and meshing, and result generalization and visualization into one solver technology.
“EMA3D Charge fills a need in a marketplace in which no other simulation product exists,” said Shane Emswiler, senior vice president of products at Ansys. “Engineers simulating charging and discharging events once had to navigate multiple codes and challenging workflows that fell short of a full solution. EMA3D Charge is a full solution—one that provides high-fidelity analysis and an end-to-end workflow designed for efficiency.”
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Teradyne Acquires TestInsight, Accelerating Time to Market for AI and Data Center Devices
04/16/2026 | BUSINESS WIRETeradyne, Inc., a leading provider of automated test equipment (ATE) and advanced robotics, announced it has acquired TestInsight, a leading provider of semiconductor test development, validation, and conversion software widely used across the industry.
Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.
ESD Alliance Reports Electronic System Design Industry Posts $5.5 Billion in Revenue in Q4 2025
04/15/2026 | SEMIElectronic System Design (ESD) industry revenue increased 10.3% to $5,466.3 million in the fourth quarter of 2025 from the $4,955.2 million registered in the fourth quarter of 2024, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report.
April Issue of I-Connect007 Magazine: Beyond the Rulebook
04/14/2026 | I-Connect007 Editorial TeamIn this month’s I-Connect007 Magazine, we asked PCB designers, fabricators, and suppliers what it really means to operate without a rulebook. Their perspectives vary, especially between seasoned designers and experienced fabricators, but a common thread emerges: progress depends on pushing boundaries and finding a way forward, even when the path isn’t clear. In many ways, this mindset has always been part of what we do, whether we’ve called it that or not.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.