-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Ansys, Electro Magnetic Applications Launch EMA3D Charge
October 21, 2021 | ANSYSEstimated reading time: 2 minutes

Together with Electro Magnetic Applications, Ansys added EMA3D Charge to its industry-leading simulation solution portfolio, addressing critical design and safety needs for applications ranging from space exploration to everyday commutes. The new solution enhances predictive accuracy for engineers analyzing charging and discharging events that can lead to catastrophic product failures early in the design cycle, driving faster time-to-market and bottom-line savings.
Aerospace, electronics and automotive industries must meet rigorous electrical performance requirements to mitigate safety risks related to charging and discharging events. Engineers need to be confident a spacecraft will survive exposure to space plasma. High-voltage systems must operate safely without risk of fire. Autonomous vehicles must maintain safety critical functions when faced with an unexpected electrical event. Without fully understanding and addressing these risks, companies may face costly late-phase redesigns, often totaling millions of dollars.
High-fidelity predictions from EMA3D Charge provide engineers with a deeper understanding of electrical charging and discharging phenomena. These insights can have a significant impact on product design, helping engineers determine how electrical components may be harmed — and to what extent — by charging and discharging events. Mitigating risks early in the design phase reduces the chances of late-stage redesigns and costly product failures.
“EMA3D Charge has an impressive array of capabilities,” said EMC engineers at NASA Johnson Space Center. “For example, its ability to easily manipulate and mesh mechanical computer-aided design (CAD) models greatly simplifies the process of going from a structural model of the spacecraft to analytical results. We have also seen great value in its ability to perform charging analysis on spacecraft that are being charged by direct contact with lunar dusts whilst simultaneously being charged from exposure to space plasmas on or near the lunar surface.”
While the technology within EMA3D Charge has been applied in the electronics and aerospace industry before, the solution is the first to be focused entirely on charging and discharging prediction. Leveraging Ansys SpaceClaim to create an intuitive user interface and workflow, EMA3D Charge combines CAD import, design and simplification, simulation setup and meshing, and result generalization and visualization into one solver technology.
“EMA3D Charge fills a need in a marketplace in which no other simulation product exists,” said Shane Emswiler, senior vice president of products at Ansys. “Engineers simulating charging and discharging events once had to navigate multiple codes and challenging workflows that fell short of a full solution. EMA3D Charge is a full solution—one that provides high-fidelity analysis and an end-to-end workflow designed for efficiency.”
Suggested Items
Würth Elektronik Now an Infineon ‘Preferred Partner’
03/13/2025 | Wurth Elektronik eiSosWürth Elektronik, one of the leading manufacturers of electronic and electromechanical components, is broadening its collaboration with semiconductor manufacturers.
Elementary Mr. Watson: Ensuring a Smooth Handoff From PCB Design to Fabrication
03/13/2025 | John Watson -- Column: Elementary, Mr. WatsonAt the 2020 Tokyo Summer Olympics, the U.S. men's 4x100-meter relay team had high hopes of winning a medal. The team comprised some of the fastest sprinters in the world, but something went wrong. In a relay, four runners must smoothly pass their baton to the next runner inside a zone on the track. If a runner drops the baton or it’s passed outside the zone, the team risks disqualification. The U.S. team’s pass between the second and third runner was messy, slowing them down. By the time the last runner received the baton, the team had lost too much time. They finished sixth in their heat and didn’t qualify for the final.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
Speaking the Same Language as Your Fabricator
03/12/2025 | Andy Shaughnessy, Design007 MagazineWe do indeed have a failure to communicate; designers and fabricators often seem to be talking past each other, which can lead to jobs being put on hold. We asked Jen Kolar, VP of engineering for Monsoon Solutions, and columnist Kelly Dack to share their thoughts on ways that we can break down the communication barrier between design and fabrication. As they point out, a design kickoff checklist and a solid review process can be invaluable tools in a designer’s toolbox.