Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
GEN3 Releases Micro Webinar Episode 5, ‘Predicting Reliability in Electronics: Materials Testing—Circuit Boards’
December 15, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.
The fifth episode, “Materials Testing—Circuit Boards,” can be viewed in under four minutes. Presenters share information on CAF and AMP, HV and LV design considerations, and other issues for consideration.
Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to... Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive or general industrial applications.
Visit Predicting Reliability in Electronics and start watching, free, today!
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
LITEON Technology Reports Consolidated August Sales of NT$15.6 Billion, Up 13% M-o-M, 30% YoY
09/10/2025 | LITEON TechnologyLITEON Technology reported its August consolidated revenue of NT$15.6 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 13% M-o-M, 30% Y-o-Y.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Elephantech Selected for NEDO’s Deep-Tech Startups Support Program in the Green Transformation field
09/09/2025 | ElephantechElephantech is pleased to announce its selection for the Demonstration development for Mass Production (DMP) phase of the 4th round of the Deep-Tech Startups Support Program in the Green Transformation field (GX) by NEDO, the New Energy and Industrial Technology Development Organization of Japan.
Ynvisible Celebrates Inauguration of New Production Facility in Norrköping, Sweden
09/09/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a pioneer in sustainable and scalable e-paper display technology and printed electronics, is pleased to announce the successful inauguration of its new roll-to-roll production facility in Norrköping, Sweden – a city globally recognized as a center of excellence for Printed and Organic Electronics.
Sypris Wins Contract for Classified Missile Avionics Program
09/09/2025 | Sypris Solutions Inc.Sypris Electronics, LLC, a subsidiary of Sypris Solutions, Inc., announced that it has received a follow-on contract award to manufacture and test advanced electronic power supply modules for integration into the avionics suite of a classified, mission-critical missile program. Production is scheduled to begin in 2026.