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Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
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If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Siemens White Paper: Overview of Channel Equalization Techniques for Serial Interfaces
January 6, 2022 | Siemens Digital IndustriesEstimated reading time: Less than a minute
The newer industry-standard SerDes protocols such as PCIe Gen6, USB4, and the 100G per-lane Ethernet and OIF/CEI standards offer an increasing challenge for PCB designers on multiple fronts. On the one hand, the speeds are approximately doubling for each generation. At the same time, the circuit board material used is often the same as the previous generations in order to keep costs down. To compensate for the increased loss at higher data rates, complex equalization techniques are employed.
From an IC design perspective, deciding what types of equalization circuits need to be incorporated in the transceivers design, has cost, power, and silicon area implications. From an EDA perspective, the large variety of compliance methods and ways to define equalization types along with their associated transfer functions and constraints leads to increased complexity of the analysis tools.
This Siemens paper will highlight some important aspects of the most popular interconnect specifications, with a focus on the reference equalizers.
To download this free white paper, click here.
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Professors from Cornell University and University of Michigan to Be Honored for Excellence in Semiconductor Research
11/07/2025 | SIASIA and SRC present the University Research Awards annually to professors who demonstrate excellence in advancing research in semiconductor technology and design.
CELUS, NextPCB Establish Strategic Partnership to Accelerate AI-Driven Electronics Design and Manufacturing
11/07/2025 | BUSINESS WIRECELUS, the developer of a leading AI-assisted electronics design platform, and NextPCB, a globally recognized PCB manufacturing and assembly service provider, announced a strategic partnership aimed at streamlining the electronics development lifecycle from concept to mass production.
Siemens, NVIDIA Preview Industrial Tech Stack for AI-Era Manufacturing
11/07/2025 | SiemensAt the NVIDIA GTC (GPU Technology Conference) in Washington, D.C., Siemens and NVIDIA demonstrated a new technology stack currently in development for the Siemens Xcelerator portfolio.
Everyone’s Talking About Power
11/06/2025 | Heidi Barnes, Keysight TechnologiesDelivering power to a digital load is an AC function, not DC. That simple statement may be obvious, but the implications of how electricity travels to an electronic load are complicated. Dynamic loads with rapidly changing currents create electric and magnetic fields that adhere to Maxwell’s equations. Ground can be misleading and is probably better used for describing where one grows potatoes and carrots. Electrical currents have “return paths,” and the energy is traveling in the fields between the power rail and the return path.
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.