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Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
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Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
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Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
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Siemens White Paper: Overview of Channel Equalization Techniques for Serial Interfaces
January 6, 2022 | Siemens Digital IndustriesEstimated reading time: Less than a minute
The newer industry-standard SerDes protocols such as PCIe Gen6, USB4, and the 100G per-lane Ethernet and OIF/CEI standards offer an increasing challenge for PCB designers on multiple fronts. On the one hand, the speeds are approximately doubling for each generation. At the same time, the circuit board material used is often the same as the previous generations in order to keep costs down. To compensate for the increased loss at higher data rates, complex equalization techniques are employed.
From an IC design perspective, deciding what types of equalization circuits need to be incorporated in the transceivers design, has cost, power, and silicon area implications. From an EDA perspective, the large variety of compliance methods and ways to define equalization types along with their associated transfer functions and constraints leads to increased complexity of the analysis tools.
This Siemens paper will highlight some important aspects of the most popular interconnect specifications, with a focus on the reference equalizers.
To download this free white paper, click here.
Suggested Items
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/10/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
Showing Some Constraint: Design007 Magazine July 2025
07/10/2025 | I-Connect007 Editorial TeamA robust design constraint strategy balances dozens of electrical and manufacturing trade-offs. This month, we focus on design constraints—the requirements, challenges, and best practices for setting up the right constraint strategy.
Elementary, Mr. Watson: Rein in Your Design Constraints
07/10/2025 | John Watson -- Column: Elementary, Mr. WatsonI remember the long hours spent at the light table, carefully laying down black tape to shape each trace, cutting and aligning pads with surgical precision on sheets of Mylar. I often went home with nicks on my fingers from the X-Acto knives and bits of tape all over me. It was as much an art form as it was an engineering task—tactile and methodical, requiring the patience of a sculptor. A lot has changed in PCB design over the years.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Bell to Build X-Plane for Phase 2 of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program
07/09/2025 | Bell Textron Inc.Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 2 of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program with the objective to complete design, construction, ground testing and certification of an X-plane demonstrator.