Electronic System Design Industry Logs 17% YoY Revenue Growth in Q3 2021
January 17, 2022 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 17.1% year-over-year from $2,953.9 million to $3,458.1 million in Q3 2021, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 16.1%.
“The industry reported double-digit year-over-year revenue growth for Q3 2021,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report.
“Geographically, all regions reported double-digit growth, with product categories CAE, Printed Circuit Board and Multi-Chip Module, SIP, and Services also showing double-digit growth.”
The companies tracked in the EDMD report employed 51,182 people globally in Q3 2021, an 8.7% increase over the Q3 2020 headcount of 47,087 and up 2.4% compared to Q2 2021.
The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.
Revenue by Product and Application Category – Year-Over-Year Change
- CAE revenue increased 13.7% to $1,054.7 million. The four-quarter CAE moving average increased 11.8%.
- IC Physical Design and Verification revenue increased 0.7% to $612.6 million. The four-quarter moving average for the category rose 16%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 14.5% to $298.3 million. The four-quarter moving average for PCB and MCM increased 10.9%.
- SIP revenue rose 30.6% to $1,373.3 million. The four-quarter SIP moving average grew 22.1%.
- Services revenue increased 12.5% to $119.1 million. The four-quarter Services moving average increased 9.2%.
Revenue by Region – Year-Over-Year Change
- The Americas, the largest reporting region by revenue, purchased $1,494.5 million of electronic system design products and services in Q3 2021, a 14.3% increase. The four-quarter moving average for the Americas rose 15.8%.
- Europe, Middle East, and Africa (EMEA) revenue increased 22.6% to $451.7 million. The four-quarter moving average for EMEA grew 11.9%.
- Japan revenue increased 11.8% to $259.8 million. The four-quarter moving average for Japan rose 3.3%.
- Asia Pacific (APAC) revenue increased 19.7% to $1,252.1 million. The four-quarter moving average for APAC increased 21.3%.
Suggested Items
A Look Into the Future with Futurist Kevin Surace
04/07/2025 | Barry Matties, I-Connect007In this interview after his keynote address at IPC APEX EXPO 2025, futurist Kevin Surace reflects on important lessons learned and how they shaped his own future. He also makes some bold predictions for the use of AI in PCB board design, fabrication, and assembly—and what the common household will look like in 10 years. It’s an exciting and adventurous step into a future where humans work alongside robots, all for the betterment of everyone.
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
IPC APEX EXPO Newcomer: Faith DeSaulnier of TTM Technologies
04/03/2025 | I-Connect007 Editorial TeamDuring the Newcomer’s Welcome Reception at IPC APEX EXPO, the I-Connect Editorial Team spoke with several first-time attendees. The following is our interview with Faith DeSaulnier, a process engineer based at TTM Technologies’ facility in Forest Grove, Oregon.
Ansys Semiconductor Solutions Certified by TSMC for Reliable, Accurate Analysis of Evolving Chip Designs
04/03/2025 | PRNewswireAnsys announced that PathFinder-SC is certified as a new ESD analysis solution for customers designing with TSMC's N2 silicon process technology. PathFinder-SC delivers a novel verification solution that provides superior capacity and performance, easily accommodating large designs in the cloud.
Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments
04/03/2025 | Real Time with...IPC APEX EXPOErik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.