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GEN3 Webinar, Part 9 Released: SIR, Additional Information
January 19, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.
The ninth episode, “SIR, Additional Information” can be viewed in just under four minutes. Presenters discuss test duration, number of coupons, and whether SIR is good to use for qualification testing. Also covered in this segment: SIR and objective evidence.
Designed to complement their book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series by GEN3 can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for objective evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive, or general industrial applications.
Visit Predicting Reliability in Electronics and start watching, free, today!
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Indium Corporation to Showcase Sustainable Solutions for Power Electronics at PCIM
05/17/2024 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation® will proudly showcase a selection of innovative products at PCIM Europe, June 11-13, in Nuremberg, Germany.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
IPC Releases May 2024 Global Sentiment of the Electronics Supply Chain Report
05/16/2024 | IPCSentiment among electronics manufacturers fell this month, after hitting a new high in April. Despite the decline, sentiment remains historically high according to IPC’s May Sentiment of the Global Electronics Manufacturing Supply Chain Report.
Sypris Reports Q1 2024 Results; Revenue Up 10%
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