-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Pin and Slant Fin Heat Sinks from ATS Offer Economical Electronics Cooling
February 28, 2022 | Advanced Thermal Solutions, Inc.Estimated reading time: 1 minute

Advanced Thermal Solutions, Inc. (ATS) is now providing Pin and Slant Fin heat sinks made from lightweight, extruded aluminum to provide low-cost cooling solutions for many hot PCB components.
Pin Fin sinks have a high efficiency design that harnesses cooling airflow from any direction. They reliably perform in spatially constrained PCB layouts where the airflow direction is variable. The pin fin field has low pressure drop characteristics for effective cooling in low airflow environments. The combined large surface areas of the pins and base increases overall heat sink performance. Where space allows, taller and denser pin fin fields, with higher aspect ratios to their bases, further increase heat dissipating surfaces to provide even higher cooling performance.
For limited airflow situations in direction-specific applications, Slant Fin heat sinks provide substantial surface area, and therefore high cooling performance. The slanted fin field extends slightly beyond their base dimensions. Like with Pin Fin heat sinks, Slant Fin sinks are fabricated from single-piece extruded aluminum, which minimizes the thermal resistance from their base to their fins
Both Pin Fin and Slant Fin heat sinks are available for component sizes 10 x 10mm up to 60 x 60mm, and standard heights from 2 to 25mm.
Pin and Slant Fin heat sinks in all standard sizes can be attached with double-sided thermal tapes. Larger sinks can be further secured with clip-type hardware, including Z-clips, and ATS’ proven maxiGRIP and superGRIP easily-installed attachment systems.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
09/05/2025 | Akrometrix LLCAkrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.
Integrated Solutions for Board-level Reliability: A Smarter Path Forward
08/27/2025 | Alan Gardner, MacDermid Alpha Electronics SolutionsIn today’s electronics manufacturing landscape, reliability is no longer just a benchmark but a business imperative. As industries such as automotive, aerospace, and high-performance computing (HPC) push the boundaries of innovation, the demand for dependable board-level performance under extreme conditions has never been greater.