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Pin and Slant Fin Heat Sinks from ATS Offer Economical Electronics Cooling
February 28, 2022 | Advanced Thermal Solutions, Inc.Estimated reading time: 1 minute

Advanced Thermal Solutions, Inc. (ATS) is now providing Pin and Slant Fin heat sinks made from lightweight, extruded aluminum to provide low-cost cooling solutions for many hot PCB components.
Pin Fin sinks have a high efficiency design that harnesses cooling airflow from any direction. They reliably perform in spatially constrained PCB layouts where the airflow direction is variable. The pin fin field has low pressure drop characteristics for effective cooling in low airflow environments. The combined large surface areas of the pins and base increases overall heat sink performance. Where space allows, taller and denser pin fin fields, with higher aspect ratios to their bases, further increase heat dissipating surfaces to provide even higher cooling performance.
For limited airflow situations in direction-specific applications, Slant Fin heat sinks provide substantial surface area, and therefore high cooling performance. The slanted fin field extends slightly beyond their base dimensions. Like with Pin Fin heat sinks, Slant Fin sinks are fabricated from single-piece extruded aluminum, which minimizes the thermal resistance from their base to their fins
Both Pin Fin and Slant Fin heat sinks are available for component sizes 10 x 10mm up to 60 x 60mm, and standard heights from 2 to 25mm.
Pin and Slant Fin heat sinks in all standard sizes can be attached with double-sided thermal tapes. Larger sinks can be further secured with clip-type hardware, including Z-clips, and ATS’ proven maxiGRIP and superGRIP easily-installed attachment systems.
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Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
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Eco-Scouts Initiative: Rehm Apprentice Team Receives Jury Award
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Specially Developed for Laser Plastic Welding from LPKF
06/25/2025 | LPKFLPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.