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FTG Announces Appointment of Robert Beutel to the Board of Directors
March 2, 2022 | Firan Technology Group CorporationEstimated reading time: Less than a minute
Firan Technology Group Corporation announced that Robert Beutel has joined FTG’s Board of Directors.
Beutel previously served on the FTG board from 2011 to 2020. In addition, Mr. Beutel has been an executive officer of Oakwest, an investment and management holding company, since 1987. Beutel is a director of several private companies.
“We are pleased to have Robert back on the FTG Board,” stated Brad Bourne, President and CEO of FTG Corporation. He added, “Robert is an experienced executive and his guidance and advice will ensure our continued success.”
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Rogers Announces Transition of Board Chair and Plans to Add New Independent Director
10/17/2025 | Rogers CorporationRogers Corporation announced that Peter Wallace, Chair of the Board of Directors, has informed the Board of his decision not to stand for re-election at the Company’s 2026 Annual Meeting of Shareholders.
Light-curable Solutions for Reliable Electronics in Space Applications
10/15/2025 | Virginia Hogan, DymaxDesigning electronics for space environments, particularly those in low Earth orbit (LEO), requires careful consideration of materials that can withstand extreme conditions while supporting long-term reliability. Engineers designing satellite systems, aerospace instrumentation, and high-altitude platforms face a familiar set of challenges: contamination control, mechanical stress, thermal cycling, and manufacturability.
Ibiden Opens Ono Plant to Expand AI Server IC Substrate Production Capacity
10/14/2025 | IBIDENIBIDEN Co., Ltd. announces that it held the opening ceremony for its Ono Plant on October 10, 2025 in Ono Town, Ibi District, Gifu Prefecture. Construction work and preparations for mass production at the plant had been underway.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax's New 9773 Ruggedized Adhesive Meets NASA ASTM E595 Low Outgassing
10/07/2025 | DymaxDymax, a leading manufacturer of rapid and light-curing materials and equipment, is pleased to add 9773 ruggedizing and staking adhesive to its portfolio of materials designed for coating, protecting, and securing components on printed circuit boards in satellites, missiles, and space applications.