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DesignCon 2022 Reveals Strong Educational Content Dedicated to Accelerating AV, IoT MarketsMarch 24, 2022 | informa
Estimated reading time: 1 minute
DesignCon, the nation's largest event for chip, board, and systems design engineers, announced the technical sessions, speaker Q&As, and demos confirmed for the 2022 conference, which, new this year, encompasses two complimentary conferences: Drive World and Embedded IoT World. With the additions of education from Drive World and Embedded IoT World, a well-established conference with a strong Silicon Valley following organized by Informa, DesignCon provides attendees access to a broader cross-selection of world renowned experts that are shaping the automotive and IoT technology of tomorrow and extends its already deep technical education offering when it returns to Santa Clara, CA, April 5-7, 2022.
The global autonomous vehicle market, valued at $76 billion in 2020 and forecasted to grow at a CAGR of 40.1% until 2030, is largely driven by the growth in connected infrastructure, the maturation of highly advanced technologies such as LiDAR, and significant investments in autonomous technology from heavyweight tech giants like Waymo, Tesla, Rivian, and Uber. Drive World at DesignCon serves as the industry’s must-attend conference, providing access to three days of technical and forward-looking education for those seeking insight topics ranging from multi-sensor calibration for ADAS applications to exploring the hardware and software that enables autonomous AI ecosystem on the edge.
Complementing Drive World is partnership with the Embedded IoT World conference, which provides a curated experience for engineers, architects, and developers using embedded technologies to bring end-to-end IoT solutions to life. It has never been more important to build safe, secure, and dependable devices that withstand the test of time so organizations can successfully integrate and commercialize end-to-end IoT solutions. Embedded IoT World at DesignCon aims to help engineers unpack the evolving standards and opportunities for connectivity, safety, and processing in the embedded community.
“The industry has made tremendous strides toward advancing autonomous vehicle technology, as well as the embedded technologies and IoT that lay the technological groundwork for progress,” said Suzanne Deffree, Group Event Director, DesignCon. “Bringing these two partner conferences to DesignCon 2022 is a strategic decision that supports our goal of providing our attendees with a comprehensive educational experience that reflects the changing direction of the industry. DesignCon’s traditional and deeply technical 14-track conference is unmatched, offering engineers ample opportunities to advance their design skills and careers in these emergent and important fields.”
Global IT corporation FPT recently signed a Memorandum of Understanding (MoU) with the multinational industrial technology conglomerate Siemens, fostering collaboration and mutually beneficial business opportunities in advancing the manufacturing sector and semiconductor chip production while accelerating digital transformation globally.
Wearable Devices Ltd. , a technology growth company specializing in artificial intelligence (“AI")-powered touchless sensing wearables, today announced a collaboration agreement with Qualcomm Technologies, Inc. This collaboration will help those looking to use Wearable Devices' innovative Mudra technology when developing products using the Qualcomm Snapdragon Spaces™ XR Developer Platform, redefining interaction in augmented reality (“AR”) and virtual reality (“VR”) environments.
Coffee has helped power people for years. Now, coffee and other bio-based resources may help power lithium-ion batteries, thanks to breakthrough technology from X-BATT®.
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, has completed a major technology update to their Photo Stencil Specialized Products Division in Golden, Colorado. The phase-one overhaul included upgrades to key areas, including imaging, chemical plating, and chemical coating, along with refreshed offices and board room.
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology.