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Making Waves With Solder Paste Jetting

09/11/2024 | Josh Casper, Horizon Sales
As electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.

MEK Launches New PowerSpector JSAz 550: Larger 3D Desktop AOI System with New Chassis

09/11/2024 | MEK
Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) and Solder Paste Inspection (SPI) technology, proudly announces the launch of its latest product, the PowerSpector JSAz 550. This new selective 3D desktop AOI system is a larger L-size model, capable of accommodating Printed Circuit Boards (PCBs) up to 550x550mm (21.7”x21.7”).

Wearable Technology Market to Grow by $87.3 Billion from 2024-2028

09/10/2024 | PRNewswire
Report on how AI is redefining market landscape- The global wearable technology market size is estimated to grow by USD 87.3 billion from 2024-2028, according to Technavio.

Smartkem, Chip Foundation Partner on MicroLED Backlight Tech

09/10/2024 | PRNewswire
Smartkem, a company that has the potential to power the next generation of displays using its disruptive organic thin-film transistors (OTFTs), announced that it has entered into a joint development agreement with Shanghai Chip Foundation Semiconductor Technology Co., Ltd., a manufacturer of semiconductor and integrated circuit devices, to co-develop a new generation of microLED-based backlight technology for Liquid Crystal Displays.

RENK, QinetiQ Announce Strategic Partnership in Advanced Mobility Technology

09/10/2024 | QinetiQ
QinetiQ and RENK Group AG, a leading supplier of military and civilian propulsion solutions have signed a strategic partnership agreement that will see the two companies jointly develop future mobility concepts for military land platforms in the weight class of 5 to 60 tons. The partnership will focus on advanced hybridisation concepts and uncrewed ground vehicles (UGVs).
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