-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
DesignCon 2022 Reveals Strong Educational Content Dedicated to Accelerating AV, IoT Markets
March 24, 2022 | informaEstimated reading time: 1 minute
DesignCon, the nation's largest event for chip, board, and systems design engineers, announced the technical sessions, speaker Q&As, and demos confirmed for the 2022 conference, which, new this year, encompasses two complimentary conferences: Drive World and Embedded IoT World. With the additions of education from Drive World and Embedded IoT World, a well-established conference with a strong Silicon Valley following organized by Informa, DesignCon provides attendees access to a broader cross-selection of world renowned experts that are shaping the automotive and IoT technology of tomorrow and extends its already deep technical education offering when it returns to Santa Clara, CA, April 5-7, 2022.
The global autonomous vehicle market, valued at $76 billion in 2020 and forecasted to grow at a CAGR of 40.1% until 2030, is largely driven by the growth in connected infrastructure, the maturation of highly advanced technologies such as LiDAR, and significant investments in autonomous technology from heavyweight tech giants like Waymo, Tesla, Rivian, and Uber. Drive World at DesignCon serves as the industry’s must-attend conference, providing access to three days of technical and forward-looking education for those seeking insight topics ranging from multi-sensor calibration for ADAS applications to exploring the hardware and software that enables autonomous AI ecosystem on the edge.
Complementing Drive World is partnership with the Embedded IoT World conference, which provides a curated experience for engineers, architects, and developers using embedded technologies to bring end-to-end IoT solutions to life. It has never been more important to build safe, secure, and dependable devices that withstand the test of time so organizations can successfully integrate and commercialize end-to-end IoT solutions. Embedded IoT World at DesignCon aims to help engineers unpack the evolving standards and opportunities for connectivity, safety, and processing in the embedded community.
“The industry has made tremendous strides toward advancing autonomous vehicle technology, as well as the embedded technologies and IoT that lay the technological groundwork for progress,” said Suzanne Deffree, Group Event Director, DesignCon. “Bringing these two partner conferences to DesignCon 2022 is a strategic decision that supports our goal of providing our attendees with a comprehensive educational experience that reflects the changing direction of the industry. DesignCon’s traditional and deeply technical 14-track conference is unmatched, offering engineers ample opportunities to advance their design skills and careers in these emergent and important fields.”
Suggested Items
2025 ASEAN IT Spending Growth Slows to 5.9% as AI-Powered IT Expansion Encounters Post-Boom Normalization
06/26/2025 | IDCAccording to the IDC Worldwide Black Book: Live Edition, IT spending across ASEAN is projected to grow by 5.9% in 2025 — down from a robust 15.0% in 2024.
DownStream Acquisition Fits Siemens’ ‘Left-Shift’ Model
06/26/2025 | Andy Shaughnessy, I-Connect007I recently spoke to DownStream Technologies founder Joe Clark about the company’s acquisition by Siemens. We were later joined by A.J. Incorvaia, Siemens’ senior VP of electronic board systems. Joe discussed how he, Rick Almeida, and Ken Tepper launched the company in the months after 9/11 and how the acquisition came about. A.J. provides some background on the acquisition and explains why the companies’ tools are complementary.
United Electronics Corporation Advances Manufacturing Capabilities with Schmoll MDI-ST Imaging Equipment
06/24/2025 | United Electronics CorporationUnited Electronics Corporation has successfully installed the advanced Schmoll MDI-ST (XL) imaging equipment at their advanced printed circuit board facility. This significant technology investment represents a continued commitment to delivering superior products and maintaining their position as an industry leader in precision PCB manufacturing.
Insulectro & Dupont Host Technology Symposium at Silicon Valley Technology Center June 25
06/22/2025 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, and DuPont, a major manufacturer of flex laminates and chemistry, invite fabricators, OEMS, designers, and engineers to attend an Innovation Symposium – Unlock the Power - this Wednesday, June 25, at DuPont’s Silicon Valley Technology Center in Sunnyvale, CA.
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.