Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
CyberOptics to Debut SE3000 SPI System with New Dual-Mode MRS Sensor at SMTconnect
April 20, 2022 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will debut the Dual-Mode Multi-Reflection Suppression (MRS) sensor-enabled SE3000 SPI system in Hall 4A, Stand 210 at SMTconnect, scheduled to take place May 10-12, 2022 in Nuremberg, Germany. The company also will demonstrate the SQ3000 Multi-Function system for AOI, SPI and CMM and feature the new SQ3000+ system.
The new Dual-Mode MRS sensor for the SE3000 SPI system provides maximum flexibility for dedicated solder paste inspection applications, with one mode for high-speed and another mode for high resolution inspection. The high accuracy, repeatability and reproducibility of the SE3000 make it ideal for effectively detecting insufficient or excess paste, height, area and other SPI applications.
MRS technology inhibits reflection-based measurement distortions caused by shiny components and surfaces for highly accurate inspection. CyberOptics’ unique sensor architecture simultaneously captures and transmits multiple images in parallel. Proprietary 3D fusing algorithms merge the images together, delivering metrology grade accuracy at production speed.
Customers worldwide are improving their yields and processes with CyberOptics’ MRS-Enabled systems. The SQ3000+ Multi-Function system for inspection and metrology is an extension of the multi-award-winning SQ3000 platform deemed best-in-class, that not only conducts AOI and SPI, but uniquely delivers in-line, full coordinate measurement (CMM) data in seconds, not hours.
The SQ3000+ all-in-one system offers a combination of unparalleled high accuracy and high speed, with an even higher resolution sensor. The system is specifically designed for high-end applications including advanced packaging, mini-LED, advanced SMT, 008004/0201 SPI, socket metrology and other challenging CMM applications.
Share on:
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.