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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Zuken Innovation World Early Bird Discount Ends April 22
April 21, 2022 | ZukenEstimated reading time: Less than a minute
Zuken is offering an Early Bird discount for Zuken Innovation World, the annual technology and user conference, June 6-9, 2022 in San Antonio, Texas.
Register now and save $400. This no-risk registration give you access to ZIW and to Integrate22, Vitech’s co-located Digital Engineering Symposium. Discount pricing expires at 11:59 PM (Central Time) on April 22.
Build your schedule choosing from more than 75 classes and sessions designed to educate and inspire. Explore what’s new classes. Learn how-to tips and tricks. Whether you need to boost your skills or are looking to broaden your knowledge, ZIW has you covered.
For more information, click here.
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The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.