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MacDermid Alpha to Highlight Low Temperature Soldering, Conformal Coating Innovations at SMTconnect
April 27, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will showcase its latest product innovations from the ALPHA, Kester and Electrolube brands at the upcoming SMTconnect exhibition in Nuremberg, Germany from Tuesday 10th - Thursday 12th May in Hall 4 Booth #125.
Highlighted this year will be Alpha’s latest innovation in low temperature solutions, ALPHA OM-565 HRL3 Solder Paste. This paste is designed to enable target reflow temperatures of 175 °C with superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP). The HRL3 alloy offers superior thermomechanical and drop shock performance compared to existing low temperature solutions. The ALPHA OM-565 chemistry enhances electrochemical performance over existing low temperature solders, providing excellent compatibility in contact rework applications with ALPHA tested cored wire and rework fluxes.
Recent data on ALPHA OM-565 HRL3 Solder Paste will be presented by Corné Hoppenbrouwers, Customer Technical Support Engineer, during his presentation ‘Next Generation Low Temperature Soldering Solutions’ at the SMTconnect exhibitor forum. Corné’s presentation will take place on Thursday 12th May at 13:40 in Hall 4A Booth #300.
The most recent addition to the MacDermid Alpha family of brands, Electrolube will feature their newest, eco-friendly range of bio-based conformal coatings and resins which incorporates fast-curing UV cure coating UVCLX and the UR5645 high performance PU resin. The advanced new UVCLX Coating is the first of its kind globally. UVCLX is a solvent-free, bio-based conformal coating that is completely unique to the industry and provides the highest levels of protection in a rapid processing time. The new bio-based polyurethane resin, UR5645 is a tough, two-part encapsulation system developed for the protection of electrical components in harsh environments. Both are suitable for an extremely wide range of high performance applications including automotive and EV requirements.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007e book library here.
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