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Indium Corporation to Present at International Microwave Symposium
April 29, 2022 | Indium CorporationEstimated reading time: 1 minute
One of the most highly demanded applications for 80Au/20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at the International Microwave Symposium, Denver, Colo., June 19–24.
One method for facilitating thermal transfer from the die to the substrate is to reduce the bondline thickness through the use of thinner 80Au/20Sn preforms. By using a thinner preform in the bondline, the heat is transferred away from the die more quickly, increasing the longevity and potential of the die. In The Effect of Semiconductor Laser Thermal Transfer in Relation to AuSn Preform Thickness, Gallery will examine the impact of AuSn preform thickness on thermal transfer by examining voiding percentages on several 80Au/20Sn preforms ranging from 0.002” to 0.00035” thick.
Gallery is a product specialist for the high-temperature business (gold and braze products) at Indium Corporation. She is responsible for researching and analyzing customer and market data, and she serves as a resource to the company’s current and prospective customers, field sales, and internal departments. She provides product and process support for solder preforms, wire, ribbon, and paste, and she helps to facilitate relationships and new business development. Gallery earned her bachelor’s degree in chemistry at the University of Albany, N.Y., U.S.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here.
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12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
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12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
12/09/2024 | SolderKing Assembly Materials Ltd,SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped up 2024 with a series of milestones that reflect its ongoing growth and commitment to innovation.