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Indium Corporation to Present at International Microwave Symposium
April 29, 2022 | Indium CorporationEstimated reading time: 1 minute
One of the most highly demanded applications for 80Au/20Sn is semiconductor laser die-attach due to recent advancements that have made lasers an economical option for a multitude of new products. However, a key challenge with semiconductor lasers is thermal management, as these devices generate a significant amount of heat. Indium Corporation Product Specialist Jenny Gallery will present on how to manage heat with AuSn preforms at the International Microwave Symposium, Denver, Colo., June 19–24.
One method for facilitating thermal transfer from the die to the substrate is to reduce the bondline thickness through the use of thinner 80Au/20Sn preforms. By using a thinner preform in the bondline, the heat is transferred away from the die more quickly, increasing the longevity and potential of the die. In The Effect of Semiconductor Laser Thermal Transfer in Relation to AuSn Preform Thickness, Gallery will examine the impact of AuSn preform thickness on thermal transfer by examining voiding percentages on several 80Au/20Sn preforms ranging from 0.002” to 0.00035” thick.
Gallery is a product specialist for the high-temperature business (gold and braze products) at Indium Corporation. She is responsible for researching and analyzing customer and market data, and she serves as a resource to the company’s current and prospective customers, field sales, and internal departments. She provides product and process support for solder preforms, wire, ribbon, and paste, and she helps to facilitate relationships and new business development. Gallery earned her bachelor’s degree in chemistry at the University of Albany, N.Y., U.S.
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here.
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09/16/2024 | Circuit Technology CenterCircuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning.
The Knowledge Base: The Pivotal Role of Solder Paste
09/16/2024 | Mike Konrad -- Column: The Knowledge BaseIn the complex world of electronics manufacturing, the humble solder paste plays a pivotal role. Often overshadowed by more conspicuous electronics assembly equipment and materials, this blend of powdered metal and flux is the unsung hero that binds the electronic circuits together. But beyond its adhesive and conductive properties, the selection of the right solder paste is crucial for ensuring the long-term reliability of electronic devices.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/13/2024 | Marcy LaRont, PCB007 MagazineAt the top of my list is “Silicon to Systems,” an interview with technology experts from IPC: Matt Kelly, Devan Iyer, and Kris Moyer. Also, this week, we hear from I-Connect007 Managing Editor Nolan Johnson, who’s been in Mexico for SMTA Guadalajara. Speaking of Mexico, I want to highlight an interview that appeared in IPC Community between Lorena Villanueva and Barjouth Aguilar of Flex, who talk about the importance of sustainability. I wrap up my recommendations with articles about solder printing and wet process control.
Making Waves With Solder Paste Jetting
09/11/2024 | Josh Casper, Horizon SalesAs electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing.
Scrutinizing Solder Printing
09/10/2024 | Nolan Johnson, I-Connect007As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.