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Connect the Dots: Designing for Reality—Routing, Final Fab, and QC
Siemens Webinar June 14: Stackup Planning and Signal Integrity
May 26, 2022 | Siemens EDAEstimated reading time: Less than a minute
Your stackup is the foundation upon which your entire PCB design is built, but often little thought is placed upon its design. When a fabricator designs and produces a stackup, they focus on the materials they have available and their process experience in order to give you the impedance values you require. However, they often don’t concern themselves with your overall signal integrity.
Siemens will discuss this, and much more, at a live webinar and Q&A on June 14, 2022. In this 30-minute webinar, we will explore how stackup design fits into the current workflow, and how the stakeholders involved—electrical engineers, materials engineers, PCB designers, SI engineers, and NPI engineers—use and interact with that design.
Attendees will learn how to:
- Identify external factors that cause loss within a stackup design
- Build a robust stackup quickly
- Select and compare dielectric materials from multiple vendors
Presenter Don Kost will discuss best practices for stackup design and show how these have been streamlined and incorporated into Z-planner Enterprise.
To register for this Siemens webinar, or for more information, click here.
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