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The Chemical Connection: How We Deal With a Technology Roadmap

10/07/2024 | Don Ball -- Column: The Chemical Connection
Ideally, we would all be aware of what future technology demands will be, at least for the near future, and take steps to be prepared to meet those demands. For most of us, however, while we may be aware of what’s coming in terms of production requirements, we usually don’t do much to get ready for them until we’re forced to by the market. We generally don’t have the time or personnel to spend on detailed planning or money to purchase any new equipment before it’s needed. So, how do most of us deal with it?

DuPont Expands Photoresist Manufacturing Capacity at Sasakami Site in Japan

10/04/2024 | DuPont
DuPont announced the successful completion of a significant expansion for photoresist manufacturing capacity at the DuPont Sasakami Site in Agano-shi, Niigata, Japan.

DENSO, ROHM Agree to Start Consideration of Strategic Partnership in the Semiconductor Field

10/01/2024 | JCN Newswire
DENSO CORPORATION and ROHM Co., Ltd. hereby announce that the two companies have agreed to start consideration of strategic partnership in the semiconductor field.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

09/20/2024 | Andy Shaughnessy, I-Connect007
It’s been a busy week in the world of PCB design and manufacturing. In this week’s roundup, there’s a little bit of everything. We have a look at PCB technology of tomorrow, an interview with an engineer who designs both PCBs and ICs, and government relations news from Washington, D.C. We also have an article on dispensing technology, and a final installment of our podcast on “designing for reality.”

Murata Unveils the World’s Smallest Multilayer Ceramic Capacitor

09/20/2024 | Murata
Murata Manufacturing Co. Ltd has expanded its innovative range of multilayer ceramic capacitors (MLCCs) with yet another groundbreaking addition. Exemplifying Murata’s continual commitment for minimization,
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