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Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 20, 2024 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It’s been a busy week in the world of PCB design and manufacturing. In this week’s roundup, there’s a little bit of everything. We have a look at PCB technology of tomorrow, an interview with an engineer who designs both PCBs and ICs, and government relations news from Washington, D.C. We also have an article on dispensing technology, and a final installment of our podcast on “designing for reality.”
Fall is here, and I for one am glad it’s not 97 degrees anymore. I’m heading out to the Anaheim Electronics and Manufacturing Show and PCB West (AEMS), a new event by the same people who run the Del Mar Electronics Show near San Diego. I hope to see you at a show!
Global Perspectives: The Future of PCB Technology
Published September 18
Marcy LaRont brings us a great interview with Joe Dickson, a senior vice president at Wus Printed Circuit Co. Ltd., and one of the foremost experts on advanced PCB technologies. In this conversation, Joe discusses the trends he’s seeing in PCB fabrication around the globe, and he explains some new processes used at Wus, including additive circuitry carrier processing, also called “known good layers.” Check it out.
PCB Designers: ‘Level Up’ IC, Packaging Knowledge
Published September 16
Chip design and PCB design have been separate disciplines for decades. But we’re starting to see a blurring of the lines between these camps. In this interview, Soo Lan Cheah discusses the silicon-to-systems concept and what she’s learned over the years designing integrated circuits and printed circuit boards. Are PCB designers of the future going to be trained in chip design, and vice versa?
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Published September 17
I grew up five miles from Washington, D.C. This area was a swamp when Pierre L’Enfant laid out the city 200 years ago. Well, in some ways, it’s still a swamp, and IPC’s Chris Mitchell has the unenviable job of keeping an eye on the politicians and bureaucrats there. Some of our elected officials will “spit” in your ear and tell you it’s rain, especially in an election year. In his latest column, Chris provides updates on plans for government investment in the PCB community, particularly in defense, and a variety of electronics industry resolutions working their way through Congress. Always a good read.
Auguring in on Dispensing
Published September 19
Dispensing isn’t one of the more exciting operations in PCB assembly, but there have been a number of innovations in this field, particularly in the past few decades. In this conversation, Sunny Agarwal of Camalot Dispensers R&D breaks down some of the advances in dispensing technology since the 1990s, such as jet dispensers, as well as strategies like their CBI (customer-based innovation) model.
Routing, Final Fab, and QC: Don’t Miss the Final Episode of On the Line With… Designing for Reality
Published September 19
If you’re a regular reader, you’ve probably been following our podcast On the Line With… Designing for Reality. In this final installment of the series, Matt Stevenson of ASC Sunstone walks us through the last stages of PCB manufacturing, specifically from a “designing for reality” viewpoint. If we’re not designing for reality, we will have problems.
Suggested Items
TSK Schill GmbH Closes 2024 With a Record Turnover
01/14/2025 | TSK Schill GmbHAt TSK, the course continues to be set for growth. Despite the turbulent market development, we were able to increase our turnover “EBIT”. We generated a large proportion of our turnover with Solution Business.
January 2025 Issue of Design007 Magazine: The Designer of the Future
01/13/2025 | I-Connect007 Editorial TeamAs we enter the new year, it’s a great time to be a PCB designer. The job is more complex than ever, and a lot of fun too. We can only wonder what the PCB designers of 1975 would think about the typical PCB designer’s workday. What will the designers' job be like for the next generations?
The Shaughnessy Report: The Designer of Tomorrow
01/14/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s a great time to be a PCB designer. The job is more complex than ever, but it's also a lot of fun. We can only wonder what the PCB designers of 1975 would think about today’s typical workday. What will the designer's job look like in the future? There has been a move toward working remotely, driven partly by the COVID pandemic and partly by reality: Many experienced designers simply will not relocate, even for a more lucrative job.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
01/10/2025 | Marcy LaRont, I-Connect007In the past couple of weeks, we’ve had some big industry news. In the automotive world, Honda and Nissan merged to form the largest car manufacturer in Japan. Before President Biden left office, he made sure to distribute more CHIPS Act money to bring some measure of electronics manufacturing back to the U.S. And former President Jimmy Carter died at the age of 100 and was honored on Thursday, reminding us all what true integrity looks like.
IPC Announces New Training Course: PCB Design for Manufacturability
01/10/2025 | IPCThis three-week online program, taught by an industry expert with over 40 years of experience, is designed to equip PCB designers with the knowledge and skills to reduce or eliminate design, documentation, and capability issues that often arise during PCB fabrication.