-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Establishment of a Share-based Long-term Incentive Scheme for Aspocomp’s Management
July 20, 2022 | AspocompEstimated reading time: 2 minutes

The Board of Directors of Aspocomp Group Plc has decided on the establishment of a share-based long-term incentive scheme for the company’s top management and selected key employees. It comprises a Performance Share Plan (also “PSP”).
The objectives of the Performance Share Plan are to align the interests of Aspocomp’s management with those of the company’s shareholders and, thus, to promote shareholder value creation in the long term as well as to commit the management to achieving Aspocomp’s strategic targets.
The Performance Share Plan consists of annually commencing individual performance share plans. The commencement of each new plan is subject to a separate decision of Aspocomp’s Board of Directors.
Each plan comprises a performance period followed by the payment of the potential share rewards in listed shares of Aspocomp. The payment of the rewards is conditional on the achievement of the performance targets set by the Board of Directors for the respective plan.
The performance period of the first plan, PSP 2022 - 2024, covers the period from the beginning of July 2022 until the end of the year 2024. The share rewards potentially payable thereunder will be paid during the first half of the year 2025. The possible subsequent plans will include a three-year performance period as in each case separately decided by the Board of Directors. The length of the first plan is shorter due to the transition phase to the new long-term incentive structure.
The performance measures based on which the potential share rewards under PSP 2022 - 2024 will be paid are cumulative EBIT and the total shareholder return of Aspocomp’s share (absolute TSR).
Eligible for participation in PSP 2022 - 2024 are approximately 20 individuals, including the members of Aspocomp’s Management Team.
If all the performance targets set for the first plan, PSP 2022 – 2024, are fully achieved, the aggregate maximum number of shares to be paid as a reward based on this plan is approximately 92,000 shares (referring to gross earnings before the withholding of the applicable payroll tax).
Other terms
The maximum value of the reward payable to the participants based on PSP is limited by a cap which is linked to Aspocomp’s share price development with a multiplier set by the Board of Directors.
If the individual’s employment with Aspocomp terminates before the payment of the reward, the individual is not, as a main rule, entitled to any reward based on the respective plan.
Aspocomp applies a share ownership recommendation to the members of the company’s Management Team. According to this recommendation each member of Aspocomp’s Management Team is expected to retain in his/her ownership at least half of the shares received under the share-based incentive plans of the company until the value of his/her share ownership in the company in case of the President and CEO corresponds to at least the CEO’s annual gross base salary and in case of the other members of the Management.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Mastering PCB Floor Planning
08/28/2025 | Stephen V. Chavez, Siemens EDAPlacement of PCB components is far more than just fitting components onto a board. It’s a strategic and critical foundational step, often called “floor planning,” that profoundly impacts the board’s performance, reliability, manufacturability, and cost. Floor planning ties into the solvability perspective, with performance and manufacturability being the other two competing perspectives for addressing and achieving success in PCB design.
Macronix Introduces Cutting-Edge Secure-Boot NOR Flash Memory
08/08/2025 | PRNewswireMacronix International Co., Ltd., a leading integrated device manufacturer in the non-volatile memory (NVM) market, announced ArmorBoot MX76, a robust NOR flash memory combining in a single device, the essential performance and an array of security features that deliver rapid boot times and iron-clad data protection.
UHDI Fundamentals: UHDI Technology and Industry 4.0
08/05/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. This article explores the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.