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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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August 2022 Issue of SMT007 Magazine Available Now
August 1, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
After two years in survival mode, it’s time for electronics manufacturers to go on the offensive. Customer demand is strong. IPC’s monthly reports suggest that there continue to be more orders than manufacturing capability, further exacerbated by the ongoing high demand for component parts.
Legislation is moving through the U.S. and European governing bodies to help fund accelerated investment in electronics manufacturing in these two regions. These capacity, capability and availability challenges are key points of organization pain for us. What are the sources of relief? Find out in the August issue of SMT007 Magazine.
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Sweeney Ng - CEE PCBSuggested Items
From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
Sanmina Reports Q2 Fiscal 2026 Financial Results
04/30/2026 | PRNewswireSanmina Corporation, a leading integrated manufacturing solutions company, reported financial results for the second quarter ended March 28, 2026 and outlook for its third fiscal quarter ending June 27, 2026.
Celestica Announces Q1 2026 Financial Results
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Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
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Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.