-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Altium Delivers Strong Performance with 23% Revenue Growth in FY22, Provides Positive Outlook for FY23
August 24, 2022 | Altium LimitedEstimated reading time: 2 minutes
Electronic design software company Altium Limited has announced its audited financial results for the year to 30 June 2022. Altium outperformed all expectations and exceeded its financial targets for revenue and margin. Highlights for the year include:
- Strong revenue growth of 23% to US$220.8 million.
- Strong underlying EBITDA margin of 36.7% (up from 34.3%).
- Recurring revenue of 75% of total revenue, with 31% growth in ARR.
- Double-digit revenue growth for Altium PCB business of 12% to US$169.3 million.
- Record revenue growth of 85% for Octopart to US$50.0 million.
- Acceleration of term-based licenses; up by 63% (33 % of all new licenses).
- Strong Altium 365 adoption with almost 24,700 monthly active users at year end (up from 19,700 in February 2022) and over 9,300 monthly active accounts at year end (up from 7,700 in February 2022).
- Strong growth in Profit After Tax of 57% to US$55.5 million.
- Earnings Per Share (EPS) grew by 57% to US$42.2 cents.
- Final dividend of AU 26 cents (AU 47 cents for full year up 18%).
Altium CEO Mr Aram Mirkazemi said “Altium delivered a strong financial performance for fiscal 2022 supported by a record performance from our Octopart business and solid growth from our Electronic Design Software business. Octopart is the market leader in electronics parts search and benefitted from the global parts shortage which we expect to continue for some time into the new financial year.”
“Altium Digital Sales has increased efficiency and has achieved a higher realized price, with minimal discounting. Additionally, we are getting a lift as our higher end enterprise grade capabilities gain mainstream adoption.”
Altium President Mr Sergey Kostinsky commented “our cloud platform Altium 365 remains well ahead of our competitors with adoption growing strongly. We now have 23% of Altium Designer subscribers who have fully adopted Altium 365 with 30% more in the process of adopting it. We are accelerating our transformative agenda for the global electronics industry where we aim to bring the business of engineering onto Altium 365 from design to supply chain and manufacturing.”
“Our business model transition from perpetual to term-based licenses is progressing well; 33% of new seats sold were term-based licenses. This, combined with the uptake of higher value seats that include Pro and Enterprise level capabilities, is driving up subscription revenue. This positive trend has accelerated our annual recurring revenue run rate and supports our drive toward our aspirational goal of US$500 million.”
Outlook
Altium is committed to revenue and margin guidance for fiscal 2023 of:
• Total Revenue between US$255 million to US$265 million (15%-20% growth)
- US$195 million to US$200 million for Electronic Design Software Business (15%-18% growth)
- US$60 million to US$65 million for Engineering Cloud Platform Business (20%-3 0% growth)
• Underlying EBITDA margin of 35%-37%
Download The Printed Circuit Designer’s Guide to… Design for Manufacturing by David Marrakchi. You can also view other titles in our full I-007eBooks library.
Suggested Items
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
I-Connect007 Releases New Episode of Meet the Author Podcast: Spotlight on Complex PCB Design
12/10/2024 | I-Connect007I-Connect007 is thrilled to announce the latest installment of its Meet the Author podcast series, hosted by Nolan Johnson. In this episode, Johnson interviews Scott Miller and Brian White of Freedom CAD, who share their expertise on complex PCB design.
Advanced Packaging and Stackup Design: December 2024—Design007 Magazine
12/09/2024 | I-Connect007 Editorial TeamIn this month's issue,, we asked our expert contributors to discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in the arena of HDI and UHDI. And with a little research, planning, and collaboration with the fabricator, any seasoned PCB designer can utilize advanced packaging.