Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
NXP Collaborates with Elektrobit
September 27, 2022 | ElektrobitEstimated reading time: 2 minutes
NXP Semiconductors has joined forces with Elektrobit to co-develop the software platform that supports NXP’s newly introduced high-voltage battery management system (HVBMS) reference design. Using Elektrobit’s Classic AUTOSAR tooling and software, the new software platform of the HVBMS reference design eases the development of HVBMS architectures for electric vehicles (EVs) by abstracting the communication and controlling interactions between the BMS microcontroller and the battery cell controllers.
As demand for battery-powered cars (EVs) continues to increase, so does the demand for improved performance, faster charging time, increased range and battery life, and improved safety. These demands drive rapid technological advancements in EV battery designs, especially for high voltages like 400V or 800V. As these batteries become more powerful and complex, more sophisticated BMS architectures are needed to ensure the safety and reliability of EVs. NXP’s HVBMS RD is a scalable ASIL D architecture composed of three modules: battery management unit (BMU), cell monitoring unit (CMU) and battery junction box (BJB). NXP’s wide portfolio of battery cell controllers, battery junction box devices, and devices for its patented electrical transport protocol link (ETPL) , along with production grade software drivers for these silicon devices, makes it easier for OEMs and Tier 1 customers to enter the growing market of HVBMS and enables them to focus effort on their unique application features.
More details: Elektrobit, a wholly-owned, independently-operated subsidiary of Continental, is a leader in embedded and connected software products and services for the automotive industry and has been collaborating with NXP for more than ten years. Utilizing Elektrobit’s EB tresos (AutoCore, AutoCore OS, and RTE), NXP’s reference application software and Complex Device Drivers (CDDs) are designed and integrated into NXP’s HVBMS RD.
“Our EB tresos AutoCore is the implementation of the Classic AUTOSAR® standard and our tooling environment, called EB tresos Studio, is used to configure these basic software modules with NXP’s software modules,” said Michael Robertson, Vice President, Head of Strategy & Product Management, , Elektrobit. “Elektrobit will additionally offer support to customers that use NXPs HVBMS platform when configuring and integrating EB tresos AutoCore into their environment, and will continue working with NXP in the second development phase of the HVBMS reference design software.”
“NXP and Elektrobit have complementary competencies,” explained Andreas Schlapka, Director & Segment Manager Battery Management Systems, NXP. “NXP has extensive knowledge in BMS, with a scalable portfolio of analog and digital silicon devices to support the full variety of BMS architectures. Elektrobit, on the other hand, has in-depth knowledge of the software architectures that are used in the automotive domain and AUTOSAR expertise. Bringing these two competencies together is key, which is why NXP selected EB to join forces to co-develop the software platform for the HVBMS reference design.”
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
Global Citizenship: Together for a Perfect PCB Solution
09/10/2025 | Tom Yang -- Column: Global CitizenshipIf there’s one thing we’ve learned in the past few decades of electronics evolution, it’s that no region has a monopoly on excellence. Whether it’s materials science breakthroughs in Europe, manufacturing efficiencies in China, or design innovations in Silicon Valley, the PCB industry thrives on collaboration.