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Simon Khesin - Schmoll Maschinen

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Removing the Bottleneck: ZOT's Transition to Direct Imaging

08/05/2026 | Marcy LaRont, I-Connect007
For many PCB fabricators, solder mask imaging can become one of the biggest constraints on production. Traditional exposure methods often involve lengthy setup times, multiple process steps, and opportunities for registration errors, leading to costly rework. ZOT Engineering Ltd., a UK-based contract electronics manufacturer specializing in PCB fabrication and assembly, recently modernized this part of its process by partnering with Schmoll Maschinen to deploy a maskless direct imaging (MDI) system.

Learning With Leo: Where Reliability Actually Hides

08/05/2026 | Leo Lambert -- Column: Learning With Leo
In my many years of training, it’s funny to see what still surprises people. For example, they’re surprised that by the time the solder melts, most of what decides whether that joint survives has already happened before the iron and even before inspection. In fact, it’s even earlier than that. In my column last month, I argued that most soldering problems are really problems of interpretation, which leads to the materials themselves, and where reliability is won or lost. So, let’s talk about what we’re actually soldering today.

Keiron Printing Technologies Raises €20.7M to Revolutionize LiFT Precision Solder Paste Printing for High-Reliability Electronics

07/22/2026 | Keiron Printing Technologies
Keiron Printing Technologies, the pioneer of Laser-Induced Forward Transfer (LiFT) precision solder paste printing, today announced it has closed a €20.7 million Series A round to end one of electronics manufacturing’s most expensive, unsolved problems – for good.

Designers Notebook: Old vs. New School System-level Packaging—Flip-Chip to Chiplets

07/08/2026 | Vern Solberg -- Column: Designer's Notebook
The electronics industry has experienced a renaissance in semiconductor package technology, driven by the need to maximize electronic product functionality while minimizing the area reserved for component mounting and interconnects. Passive surface mount components are relatively small, while the packaged semiconductor die is significantly larger than the tiny die element it encases. The plastic-packaged semiconductor, although suitable for use on PCBs, is far too bulky for those developing electronics that require miniaturization: new product introduction systems for physically stressful operating conditions, such as aeronautics, military ordinance, and space missions.

KYZEN to Highlight Understencil Cleaning Solutions at SMTA Querétaro Expo and Tech Forum

07/07/2026 | KYZEN
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 16, at Centro de Congresos y Teatro Metropolitano de Querétaro.
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