- design007 Magazine
Latest IssuesCurrent Issue
In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
- Events||| MENU
- design007 Magazine
Siemens Webinar Nov. 30: Glass-Weave Skew MitigationNovember 22, 2022 | I-Connect007 Editorial Team
Estimated reading time: 1 minute
Understanding and controlling sources of differential-pair skew is critical to signal integrity and reduces the potential for nightmarish field failures.
Differing micro-environments can cause slight signal delays within a differential pair, leading to apparently random field failures in production. This is known as glass weave skew, a phenomenon that's easier to prevent that predict.
A serial link’s differential-skew budget shrinks as bit rates increase. For example, a 1 Gbps (500 MHz) signal would have roughly 250 ps of skew tolerance. That’s a wide window, and why most engineers didn’t need to worry about GWS 20+ years ago.
In this November 30, 2022 webinar we explore eleven possible solutions to help prevent glass-weave skew, with an eye toward manufacturing costs and future-proofing your designs.
The webinar covers
- Deterministic methods for addressing GWS
- Probabilistic GWS mitigation methods
- Glass styles and their relative suitability for mitigating GWS
About the presenter
Bill Hargin is the chief everything officer at Z-zero, developer of the PCB stackup design and material selection software, Z-planner Enterprise. Bill is an industry pioneer, with more than 25 years working in PCB signal integrity and manufacturing, while authoring dozens of articles on signal integrity, stackup design, and material selection. Hargin is also the author of the I-Connect007 eBook The Printed Circuit Designer’s Guide to…Stackups, the Design within the Design.
To register for this webinar, or for more information, click here.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.