Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
Heraeus Marks Second Anniversary of Center of Excellence for Advanced Packaging in Singapore
December 2, 2022 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics celebrated the second anniversary of its Center of Excellence for Advanced Packaging in Singapore with a customer event.
Established in April 2020, the Center of Excellence is a hub for both innovation and applications teams, aimed at the development of new products and solutions for advanced packaging that answer customer needs in the light of the latest key mega trends. Market trends such as 5G communication, IoT (Internet of Things), AI (Artificial Intelligence) and HPC (High Performance Computing) are revolutionizing our daily life and depend heavily on the miniaturization of semiconductor electronics systems. Heraeus Electronics plays a major role by developing materials and applications solutions for its customers.
The Center of Excellence in Singapore focuses on product development, including advanced packaging solder pastes, sinter pastes, solder wires and bonding wires. It houses the latest equipment from powder development and chemical formulation, advanced measurement, to semiconductor application equipment.? Today, the team is comprised of 26 research and development scientists, including 6 PhDs.
“Singapore is our strategic innovation hub for world-class advanced packaging development,” says SS Kang,Head of Innovation, BL semiconductor. “We are continuously investing in the Center of Excellence to ensure that the latest equipment and products developed are perfectly suited to high technology markets.”
Since its inauguration in 2018, the Center of Excellence has seen an increase in capital expenditure (CAPEX) of more than 350 percent higher compared to 2017. In the last five years Heraeus Electronics has had an average CAPEX allocation of USD379K each year, which equates to a total USD1.9 million CAPEX investment. There also has been a consistent average operating expense (OPEX) allocation of USD2.5M over the past five years.
As part of its strategic plan, Heraeus Electronics will continue to increase its investment with the expansion of its current team to innovate current and expand new product portfolios to explore new markets such as high-performance computing (HPC) and Micro LED.
The plan also will help to strengthen Singapore’s global position in advanced packaging capabilities, creating new jobs and further increasing collaborations within the value chain.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.