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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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December 2022 Issue of Design007 Magazine Available NowDecember 12, 2022 | Andy Shaughnessy, Design007
Estimated reading time: Less than a minute
A Show Within a Show
The specials on the upcoming IPC APEX EXPO 2023 show’s menu are mouthwatering for PCB designers. With more content than ever targeted at your demographic, it’s becoming a show within a show. Order up!
PCB designers will find more design curriculum than ever at this show being held next month for the last time in the foreseeable future in San Diego, Calif. Between the Professional Development Courses and Technical Conference, we counted 15 different classes that focus on PCB design or design-related topics.
There’s certainly a thirst for knowledge among PCB designers. Every year, more of the “silverback” senior designers retire to the pickleball courts (seriously, pickleball?), taking with them decades of design knowledge and experience. All of which means that there’s a premium on solid PCB design education.
So, for this month's magazine, we asked IPC’s show staff and Professional Development instructors to discuss their design content, as well as some of the reasons why PCB designers should consider adding this show to their continuing education schedule.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop01/25/2024 | KIC
KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
Panasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
In my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering09/18/2023 | ViTrox
ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.