Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Dymax Expands Light-Curable Product Portfolio for Consumer Wearable Assembly

09/29/2026 | Dymax
Dymax, a global manufacturer of light-curing adhesives and equipment, launches 9208-W and 9209-W, the newest additions to its 9200-Series product line.

Zuken Adds Dashboard to Harness Builder 2027 for Wire Harness Production Tracking

09/29/2026 | Zuken
Zuken announced Harness Builder 2027 for E3.series, adding Dashboard to give manufacturing teams a shared view of wire harness production progress.

Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium

09/28/2026 | Indium Corporation
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.

Lyntris Qualifies SPY-6 Radar Assembly for Naval Supply Chain

09/24/2026 | PRNewswire
Lyntris Inc., a defense technology company delivering sense-to-act connectivity solutions for the modern, connected battlespace, announced that it has completed qualification of a critical hardware assembly supporting Raytheon's SPY-6 family of radars.

FCT Introduces Liquid Leak Detection Flex Assembly for AI and High-Performance Computing Systems

09/21/2026 | Flexible Circuit Technologies
Flexible Circuit Technologies Inc. (FCT) is pleased to announce the development of its Liquid Leak Detection Flex Assembly, a custom-engineered sensing solution designed for liquid-cooled AI servers, high-performance computing (HPC) systems, cold plates, manifolds, quick disconnects, coolant distribution units (CDUs), and other mission-critical electronics.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in