-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSilicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Mechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
DesignCon Returns to Santa Clara
December 29, 2022 | DesignConEstimated reading time: 2 minutes
DesignCon, the nation's must-attend event for chip, board and systems design engineers, today announces registration for the Jan. 31- Feb. 2 event at the Santa Clara Convention Center is now live. The 2023 expo will host technical paper sessions, tutorials, industry panels, product demos, 120+ exhibits and present some of the industry’s most influential companies, including host sponsor Amphenol and others such as Cadence, Keysight, Molex, Mouser, Samtec, and TE Connectivity.
DesignCon, the premier high-speed communications and system design conference and exposition, will host three days of deeply technical conference opening and two days of exhibition. All conference passholders will have access to 14 tracks of education created by engineers, with more than 100 sessions curated by the 97-person Technical Program Committee, which are expertly reviewed by the advising panel of engineers each year to meet the needs of the ever-evolving industry.
“We could not be prouder to facilitate an outlet where learning is at the forefront for this high-powered industry, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley,” says Suzanne Deffree, Group Event Director of DesignCon. “It is rewarding to connect the industry’s leading professionals with DesignCon as the live hub to showcase creativity and ingenuity that the design engineering trade is bringing to new heights.”
The global engineering and design market is projected to grow to $1.5 Tn by 2023. DesignCon aims to address the main contributors to this market, such as the projected growth of global 5G technology market to $700 B; expected $1.3 Tn value of Internet of Things (IoT) over the next three years; the $519.65 B size of the electronic components market by this coming year; and other areas of growth such as autonomous driving, cables and connectors, EDA software, printed circuit boards, and test and measurement.
DesignCon will also host Drive World for the third year to help advance the automotive sector with access to technical education on automotive electronics and intelligence alongside design engineering content. With the automotive artificial intelligence market projected to grow over 30% from 2021-2026 and expected to reach USD 16.2 Billion in 2026, Drive World’s educational offerings on automotive technology are a must-attend for electrical and mechanical engineers looking help accelerate the path to autonomous driving.
Five webinars will also be available on DesignCon’s digital platform prior to the in-person event for all registered attendees. These webinars, as well as select sessions recorded at the live event, will be available for viewing on the Smart Event platform through the end of February. The digital platform also provides the opportunity to research suppliers and products and network before and after attending DesignCon in Santa Clara, CA.
DesignCon's "Engineer of the Year" Award will also be given during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level. The award winner is selected based on his or her leadership, creativity, and out-of-the-box thinking brought to designing and testing of chips, boards, and systems, with particular attention paid to areas of signal and power integrity. Voting for the 2023 Engineer of the Year Award open December 23, at https://forms.gle/sCYyBL5GwjBgpg1c8.
Registration is now open for all attendees, visit www.designcon.com to get a pass.
Suggested Items
Zuken Introduces Harness Builder 2025 for E3.series with Enhanced Integration and Documentation Capabilities
09/11/2024 | ZukenZuken, a global leader in electrical and electronic digital engineering solutions, is proud to unveil the 2025 version of its industry-leading Harness Builder for E3.series software.
StratEdge Semiconductor Packages Set to Take the Spotlight at European Microwave Week and IMAPS Symposium
09/11/2024 | StratEdgeStratEdge Corporation announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
Register Now for NEDME 2024
09/11/2024 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) is back for another year of innovation, collaboration, and industry-leading insights. On Wednesday, October 30, 2024, join professionals from the electronics design and manufacturing sector at the Wingspan Event & Conference Center for a full day of cutting-edge exhibits, expert speakers, and unparalleled networking opportunities.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
Sondrel Announces Advanced Modelling Process for AI Chip Designs
09/10/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.