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DesignCon Returns to Santa ClaraDecember 29, 2022 | DesignCon
Estimated reading time: 2 minutes
DesignCon, the nation's must-attend event for chip, board and systems design engineers, today announces registration for the Jan. 31- Feb. 2 event at the Santa Clara Convention Center is now live. The 2023 expo will host technical paper sessions, tutorials, industry panels, product demos, 120+ exhibits and present some of the industry’s most influential companies, including host sponsor Amphenol and others such as Cadence, Keysight, Molex, Mouser, Samtec, and TE Connectivity.
DesignCon, the premier high-speed communications and system design conference and exposition, will host three days of deeply technical conference opening and two days of exhibition. All conference passholders will have access to 14 tracks of education created by engineers, with more than 100 sessions curated by the 97-person Technical Program Committee, which are expertly reviewed by the advising panel of engineers each year to meet the needs of the ever-evolving industry.
“We could not be prouder to facilitate an outlet where learning is at the forefront for this high-powered industry, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley,” says Suzanne Deffree, Group Event Director of DesignCon. “It is rewarding to connect the industry’s leading professionals with DesignCon as the live hub to showcase creativity and ingenuity that the design engineering trade is bringing to new heights.”
The global engineering and design market is projected to grow to $1.5 Tn by 2023. DesignCon aims to address the main contributors to this market, such as the projected growth of global 5G technology market to $700 B; expected $1.3 Tn value of Internet of Things (IoT) over the next three years; the $519.65 B size of the electronic components market by this coming year; and other areas of growth such as autonomous driving, cables and connectors, EDA software, printed circuit boards, and test and measurement.
DesignCon will also host Drive World for the third year to help advance the automotive sector with access to technical education on automotive electronics and intelligence alongside design engineering content. With the automotive artificial intelligence market projected to grow over 30% from 2021-2026 and expected to reach USD 16.2 Billion in 2026, Drive World’s educational offerings on automotive technology are a must-attend for electrical and mechanical engineers looking help accelerate the path to autonomous driving.
Five webinars will also be available on DesignCon’s digital platform prior to the in-person event for all registered attendees. These webinars, as well as select sessions recorded at the live event, will be available for viewing on the Smart Event platform through the end of February. The digital platform also provides the opportunity to research suppliers and products and network before and after attending DesignCon in Santa Clara, CA.
DesignCon's "Engineer of the Year" Award will also be given during the DesignCon event. The award seeks to recognize the best of the best in engineering and new product advancements at the chip, board, or system level. The award winner is selected based on his or her leadership, creativity, and out-of-the-box thinking brought to designing and testing of chips, boards, and systems, with particular attention paid to areas of signal and power integrity. Voting for the 2023 Engineer of the Year Award open December 23, at https://forms.gle/sCYyBL5GwjBgpg1c8.
Registration is now open for all attendees, visit www.designcon.com to get a pass.
Cadence’s digital and custom/analog flows are certified on the Intel 18A process technology. Cadence® design IP supports this node from Intel Foundry, and the corresponding process design kits (PDKs) are delivered to accelerate the development of a wide variety of low-power consumer, high-performance computing (HPC), AI and mobile computing designs.
Intel Corp. (INTC) launched Intel Foundry as a more sustainable systems foundry business designed for the AI era and announced an expanded process roadmap designed to establish leadership into the latter part of this decade.
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Intel Foundry Services (IFS) and Cadence Design Systems, Inc. (Nasdaq: CDNS) announced they have expanded their partnership and entered into a multiyear strategic agreement to jointly develop a portfolio of key customized IP, optimized design flows and techniques for Intel 18A technology featuring RibbonFET gate-all-around transistors and PowerVia backside power delivery.