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February 2023 Issue of Design007 Magazine Available Now
February 8, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Shrinking Silicon: A Warp Speed Facilitator
As we all learned by watching Star Trek, a lot of crazy things can happen at warp speed. There’s just no room for error at warp speed. Now, many PCB designers are dealing with increasing signal speeds and rise times, and a parliament of other effects—some positive, some negative—thanks to shrinking silicon. Not quite warp speed, but a lot of unpredictable things can happen when the die gets tiny.
So, in this issue, our expert contributors discuss the causes and effects of silicon shrinkage, including how to better manage EM strategies and signal integrity, as signal speeds and rise times continue their trek toward warp speed.
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Skoltech Team Develops Modulator for Compact Photonic Integrated Circuits
04/28/2026 | SkoltechResearchers at Skoltech have developed an ultra-compact electro-optic modulator based on silicon photonics and plasmonics that enables high-efficiency optical signal control within a small device footprint.
Kitron to Expand Swedish Manufacturing Footprint
04/24/2026 | KitronKitron plans to build a larger facility for its subsidiary, Kitron Eltech (formerly DeltaNordic), in Örnsköldsvik, Sweden.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
Keysight Collaborates with 3dB Labs to Enable Interoperable Signal Monitoring and Analysis
03/12/2026 | BUSINESS WIREKeysight Technologies, Inc. announced the integration of Keysight spectrum analyzers and FieldFox handheld analyzers with 3dB Labs’ Sceptre, expanding interoperability between signal monitoring hardware and analysis software.
What Makes Modern PCB Design So Difficult
02/05/2026 | Stephen V. Chavez, PCEAPCB design has undergone a fundamental yet exhilarating transformation over the past two decades. It truly feels like we're always pushing the boundaries of what's possible, which significantly increases the potential for a whole new set of challenges, and why we must always be forward-looking when it comes to the evolution of PCB design. Once viewed primarily as a physical realization of a schematic, the PCB is now a critical performance-determining element of nearly every advanced electronic system.