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February 2023 Issue of Design007 Magazine Available Now
February 8, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Shrinking Silicon: A Warp Speed Facilitator
As we all learned by watching Star Trek, a lot of crazy things can happen at warp speed. There’s just no room for error at warp speed. Now, many PCB designers are dealing with increasing signal speeds and rise times, and a parliament of other effects—some positive, some negative—thanks to shrinking silicon. Not quite warp speed, but a lot of unpredictable things can happen when the die gets tiny.
So, in this issue, our expert contributors discuss the causes and effects of silicon shrinkage, including how to better manage EM strategies and signal integrity, as signal speeds and rise times continue their trek toward warp speed.
Suggested Items
Beyond Design: High-speed Rules of Thumb
11/21/2024 | Barry Olney -- Column: Beyond DesignThe idiom “rule of thumb” is often used in electronics design and has its origins in the practice of measuring roughly with one’s thumb. Rules of thumb are easy-to-remember, broadly accurate guides or principles based on practice rather than theory. They are used to help feed our intuition to find a quick solution based on experience. We are often forced to use rules of thumb in PCB design in the absence of expensive analysis tools. We also use them to get quick ballpark figures initially and then fine-tune the numbers with further analysis. We can use rules of thumb as a sanity check to assess whether we are using our tools correctly. In this month’s column, I will present some commonly used and helpful rules for high-speed PCB design.
Material Insight: David Griesel: Career Success Requires Tenacity, Flexibility
10/23/2024 | Dr. Preeya Kuray -- Column: Material InsightDavid Griesel, CEO of Sunrise Group, has been in the PCB industry for nearly 50 years. “I didn’t even have a desk when I started,” says David, who, as a fresh college graduate, got his start at Norplex, a company in Wisconsin that made plastic. “At that time, I had no idea what plastic was even about.” But it gave him an opportunity to learn the business from the ground up. He worked in customer service, followed by technical sales and marketing through several iterations of the company, including as Isola. I hope you’ll enjoy this interview with David as much as I did.
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
10/21/2024 | FoxconnFIT Hon Teng, a subsidiary of Hon Hai Precision Industry, will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit.
Elementary, Mr. Watson: The Gooey Centers of Hybrid PCB Designs
10/09/2024 | John Watson -- Column: Elementary, Mr. WatsonAnyone who knows me knows that I have a special relationship with food. Taking a twist on the words of Will Rogers, "I never met a buffet I didn't like." A balanced diet, to me, means having cupcakes in both hands. One of my favorite foods is cheeseburgers. One of my colleagues at Palomar College recently invited me out for a meal, and we ended up in a burger place in San Diego. I wanted to go the conventional and safe route: a double-patty cheeseburger. My friend insisted that I try the restaurant’s special: a peanut butter cheeseburger. “Really?” I told him. “What an interesting combination.” But he insisted I try it, and since I consider myself an adventurous person, I gave it a go.
Stringent High-speed Requirements Pose Technology Challenges
10/03/2024 | Tarja Rapala and Joe Beers, iNEMIThe ever-increasing demands on printed circuit boards to satisfy the needs of tomorrow’s products means that PCB manufacturers must continuously evolve and react to a wide variety of technological and market requirements such as: Functional density: Finer features, higher density, and increased layers; signal integrity: Higher frequencies, driven by higher data transfer speeds and increased data needs; material properties refinement: Must meet performance as well as environmental demands; Smart manufacturing: Automation, robotics, artificial intelligence, augmented and virtual reality, and machine learning are all part of the future PCB manufacturing floor; and time-to-market: Increased urgency to facilitate new design implementation, product introduction and qualification, quicker market differentiation, and survival.