Connect the Dots: Proactive Controlled Impedance
Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
February 2023 Issue of Design007 Magazine Available Now
February 8, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Shrinking Silicon: A Warp Speed Facilitator
As we all learned by watching Star Trek, a lot of crazy things can happen at warp speed. There’s just no room for error at warp speed. Now, many PCB designers are dealing with increasing signal speeds and rise times, and a parliament of other effects—some positive, some negative—thanks to shrinking silicon. Not quite warp speed, but a lot of unpredictable things can happen when the die gets tiny.
So, in this issue, our expert contributors discuss the causes and effects of silicon shrinkage, including how to better manage EM strategies and signal integrity, as signal speeds and rise times continue their trek toward warp speed.
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