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APCT Completes the Acquisition and Merger with Advanced Circuits
February 17, 2023 | APCTEstimated reading time: 1 minute
APCT, a designer and custom manufacturer of advanced technology printed circuit boards, has completed the previously announced acquisition and merger with Advanced Circuits, Inc. and its affiliated entities and subsidiaries. APCT, headquartered in Santa Clara, California, is a portfolio company of Industrial Growth Partners.
Advanced Circuits is a software-enabled designer and manufacturer of small-run, quick-turn and low-volume production printed circuit boards, including multi-layer rigid and high-density interconnect (HDI) products. ACI operates from facilities in Colorado, Minnesota, and Arizona.
“We are thrilled to partner with Advanced Circuits. Through this merger, we will be able to serve our combined customer base across multi-layer rigid, HDI, flex, rigid-flex and specialty product categories for all quick-turn, low-volume and high-volume program needs. Further, ACI will bring several commercial and operational software solutions to enhance our customer experience. I am excited to welcome each member of the Advanced Circuits team to the APCT family,” commented Steve Robinson, CEO of APC
Acquisition Details:
- On January 10, 2023, APCT entered into a definitive agreement to acquire and merge with ACI.
- On February 14, 2023, APCT completed the acquisition and merger with ACI. Following the merger, ACI now operates as a wholly owned subsidiary of APCT.
APCT and IGP continue to seek add-on acquisitions that can enhance APCT’s position as a designer and custom manufacturer of advanced technology printed circuit boards.
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Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup
01/07/2025 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.