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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
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From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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SIA Welcomes Secretary Raimondo’s Commitment to Swift, Effective Implementation of CHIPS and Science Act
February 24, 2023 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding U.S. Commerce Secretary Gina Raimondo’s remarks on implementation of the CHIPS and Science Act.
“Secretary Raimondo has been a tireless advocate for the CHIPS and Science Act, the historic new law that will reinvigorate chip production and innovation in America. Since the CHIPS Act was introduced, companies in the semiconductor ecosystem have announced new projects across America totaling hundreds of billions of dollars in private investments and supporting hundreds of thousands of new jobs. These new projects—combined with the new law’s critical investments in semiconductor research—will help strengthen America’s economy, national security, critical supply chains, and leadership in the semiconductor-driven technologies of today and tomorrow.
“As the Secretary highlighted today, we must now ensure the CHIPS Act is implemented efficiently, effectively, and expeditiously. We share her ambitious vision that CHIPS implementation provides an historic opportunity to ‘unite behind a shared objective … and think boldly and think big.’ We look forward to working with Secretary Raimondo and other leaders in the Administration to advance the CHIPS Act’s goals of strengthening our economy and national security and making our supply chains more resilient.”
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SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
05/01/2026 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.
SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
Teradyne Reports New Record High in Q1 2026
04/30/2026 | BUSINESS WIRETeradyne, Inc. reported revenue of $1,282 million for the first quarter of 2026 of which $1,111 million was in Semiconductor Test, $91 million in Robotics, and $80 million in Product Test. GAAP net income for the first quarter of 2026 was $398.9 million, or $2.53 per diluted share.
SEMI Reports 13% Year-on-Year Growth in Global Silicon Wafer Shipments in Q1 2026
04/30/2026 | SEMIThe SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.