-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
April 2023 Issue of Design007 Magazine Available Now
April 10, 2023 | I-Connect007Estimated reading time: Less than a minute

Once a small but steady percentage of all PCB designs, RF is becoming more commonplace in this segment. The last few decades have brought on a proliferation of wireless handheld devices, and almost all of them feature some type of RF circuitry. RF is increasingly cited in I-Connect007 surveys as an area of concern.
In the April 2023 issue of Design007 Magazine, our expert contributors dial in on the best practices for designing RF PCBs for wireless communications, and shine a light on the many trade-offs involved, from material selection to board-level design techniques, and much more.
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
Suggested Items
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
Trust in the Process: Zollner Elektronik Heavily Investing in a Future Filled With Electronics
04/30/2025 | Michelle Te, IPC CommunityFamily goals and values—born by one man tinkering around in his garage in Bavaria near the Czech border—are the cornerstones of IPC member Zollner Elektronik AG, one of the 15 largest EMS companies in the world, and the largest in Germany. The company places heavy priority on its employees, products, and partnerships.
NCAB Acquires 100% of B&B Leiterplattenservice GmbH in Germany
04/23/2025 | NCABNCAB has signed an agreement to acquire 100 percent of B&B Leiterplattenservice GmbH (B&B) headquartered in Mittweida, west of Dresden. The company had net sales of around 150 MSEK in 2024 within the PCB trading with an EBITA exceeding SEK 20 million.
PCB007 Magazine: The Essential Guide to Surface Finishes—March 2025
03/17/2025 | I-Connect007 Editorial TeamIn the March 2025 issue of PCB007 Magazine, we go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore.
Punching Out: Fewer Than 150 PCB Shops Remain in North America
03/20/2025 | Tom Kastner -- Column: Punching Out!According to GP Ventures’ database, the number of printed circuit board manufacturing companies in North America (including Canada), is now below 150. In 2020, it was around 200, and in 2022, it was 170. These figures do not include companies that only import or assemble boards. Please note that we are counting PCB companies and not facilities, so TTM Technologies counts as one, Summit as one, AdvancedPCB as one, etc. The total number of facilities is probably higher by around 30.