Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
April 2023 Issue of Design007 Magazine Available Now
April 10, 2023 | I-Connect007Estimated reading time: Less than a minute
Once a small but steady percentage of all PCB designs, RF is becoming more commonplace in this segment. The last few decades have brought on a proliferation of wireless handheld devices, and almost all of them feature some type of RF circuitry. RF is increasingly cited in I-Connect007 surveys as an area of concern.
In the April 2023 issue of Design007 Magazine, our expert contributors dial in on the best practices for designing RF PCBs for wireless communications, and shine a light on the many trade-offs involved, from material selection to board-level design techniques, and much more.
Preview or download your PDF copy today! Subscribe here for delivery in your e-mailbox.
Share on:
Suggested Items
VDMA Forecast 2025: German Robotics and Automation Faces 10% Revenue Drop Investment Restraint Shapes the Outlook
06/02/2025 | VDMAThe robotics and automation industry in Germany is expected to generate total sales of €14.5 billion in 2025. This is a drop of ten percent compared to the previous year.
Zero Touch Data Package: The Future of Seamless PCB Manufacturing
05/22/2025 | Dana Korf, Victory Giant TechnologyImagine a day when a design data file—not a traditional documentation package—is output directly from the eCAD system, transmitted to selected fabricators, and automatically loaded into their engineering/CAM systems, initiating tooling and production without any human intervention. This is zero touch data transfer in action. By eliminating manual processes, front-end personnel at fabrication facilities can be redeployed to strategic areas such as R&D and customer engagement.
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
Trust in the Process: Zollner Elektronik Heavily Investing in a Future Filled With Electronics
04/30/2025 | Michelle Te, IPC CommunityFamily goals and values—born by one man tinkering around in his garage in Bavaria near the Czech border—are the cornerstones of IPC member Zollner Elektronik AG, one of the 15 largest EMS companies in the world, and the largest in Germany. The company places heavy priority on its employees, products, and partnerships.
NCAB Acquires 100% of B&B Leiterplattenservice GmbH in Germany
04/23/2025 | NCABNCAB has signed an agreement to acquire 100 percent of B&B Leiterplattenservice GmbH (B&B) headquartered in Mittweida, west of Dresden. The company had net sales of around 150 MSEK in 2024 within the PCB trading with an EBITA exceeding SEK 20 million.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in