Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
NextFlex Calls for 3D Imaging Technology Proposals
May 10, 2023 | Nolan Johnson, I-Connect007Estimated reading time: 1 minute
Nolan Johnson talks with Scott Miller about a special "Open Project" call for proposals which NextFlex currently is exploring for methods to dewarp 3D scans of physical boards to enable multi-image scans to be stitched together. There is the possibility of funding for viable proposals. Deadline is May 15, 2023.
About NextFlex Project Calls
Along with developing the workforce of the future and promoting a sustainable advanced manufacturing ecosystem, NextFlex is also focused on accelerating flexible electronics technology innovation and commercialization through pre-competitive partnerships.
Via a series of Project Calls that provide cash awards to proposal teams for development projects that are critical to Flexible Hybrid Electronics (FHE) manufacturing, NextFlex underwrites up to 50% of the development costs of selected projects. The Project Call process follows a structured selection process and rigorous oversight methodology to ensure diversity and breadth in the selection of projects funded.
About Open Project Calls
Opportunities exist to move the Flexible Hybrid Electronics (FHE) industry forward that are either outside the scope of traditional Project Call topics or are revolutionary ideas of which the NextFlex Technical Working Groups and community may not be aware. The Open Project Call has been established to respond to these advanced manufacturing and flexible electronics opportunities through an RFI (Request for Ideas), to which proposers may submit a white paper. Learn more.
Share on:
Suggested Items
Connect the Dots: The Future of PCB Design and Manufacturing
07/02/2025 | Matt Stevenson -- Column: Connect the DotsFor some time, I have been discussing the increasing complexity of PCBs and how designers can address the constantly evolving design requirements associated with them. My book, "The Printed Circuit Designer’s Guide to… Designing for Reality," details best practices for creating manufacturable boards in a modern production environment.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.
STI Celebrates Travis Wease’s 10 Years of Dedicated Service
06/17/2025 | STI Electronics, Inc.STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract electronic manufacturing, proudly celebrated the 10-year work anniversary of Travis Wease, Master Instructor and valued team member.
Roca Printed Circuits Joins Forces with Epec Engineered Technologies, NetVia
05/14/2025 | Epec Engineering TechnologiesRoca Printed Circuits and Epec Engineered Technologies announced today that Roca has joined forces with Epec’s NetVia Group PCB division in Dallas, expanding the combined organization's ability to deliver a broader range of high-quality printed circuit boards and electronic solutions.
Candor Elevates PCB Fabrication Services with Continued Facility Upgrades
04/28/2025 | Candor CircuitsOntario-based circuit board manufacturer, Candor Circuit Boards has recently completed a series of facility upgrades to improve their PCB offerings. These investments will allow Candor to provide higher volumes of complicated boards more efficiently with better yield. The new technology has allowed the company to take on exciting high technology projects and collaborations in industries such as Military and Aerospace, Medical, Energy and more.