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Honda, Renesas Sign Agreement to Develop High-Performance SoC for Software-Defined Vehicles

01/10/2025 | JCN Newswire
Honda Motor Co., Ltd. and Renesas Electronics Corporation announced that they have signed an agreement to develop a high-performance system-on-chip (SoC) for software-defined vehicles (SDVs).

Hexagon to Acquire Septentrio; Revolutionizing Positioning in Mission-critical Navigation and Autonomy Applications

01/09/2025 | Hexagon
Hexagon announced an agreement to acquire Septentrio NV, a market leader and OEM provider of Global Navigation Satellite System (GNSS) technologies, to drive innovation and expand the market reach of Resilient Assured Positioning solutions.

Kyocera Participates in TactoTek Funding with €5 Million Investment and Strategic Partnership

01/09/2025 | TactoTek
TactoTek, the global leader in In-Mold Structural Electronics (IMSE) technology, announced that Kyocera, a global innovation leader in fine ceramic components, electronics, and technology solutions, has joined TactoTek’s current funding round with an investment of €5 million.

Siemens Launches New Program to Empower Startups with Cutting-edge Technology

01/07/2025 | Siemens
Siemens launched Siemens for Startups, a new program to empower early-stage engineering and manufacturing startups.

SIA Welcomes Announcement of New CHIPS for America R&D Facility in Arizona for Semiconductor Prototyping and Advanced Packaging

01/07/2025 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement of a new CHIPS for America research and development (R&D) facility in Arizona for semiconductor prototyping and advanced packaging.
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